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Advanced Packaging Module Development Engineer

Job in Hillsboro, Washington County, Oregon, 97104, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-10-18
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 133800 - 255200 USD Yearly USD 133800.00 255200.00 YEAR
Job Description & How to Apply Below
## Advanced Packaging Module Development Engineer Apply:
US, Oregon, Hillsboro:
Full time:
Posted Today:
End Date:
December 25, 2026 (30+ days left to apply):
JR0287417#
** Job Details:**##

Job Description:

Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and human progress. With decades of pioneering research and development, Intel is at the forefront of designing and manufacturing the world's most advanced chips and technologies. Our Oregon campus in Hillsboro is one of Intel's largest and most strategically important sites globally, serving as a hub for cutting-edge semiconductor research, development, and high-volume manufacturing.

At Intel, we believe in the power of human ingenuity and are committed to creating an inclusive, collaborative environment where brilliant minds come together to solve the world's most complex technological challenges.

We are seeking a highly motivated and technically skilled Process Integration Engineer to join our dynamic team in Hillsboro, Oregon. In this critical role, you will be at the intersection of innovation and manufacturing, driving technology development and enablement for both high-volume manufacturing and next-generation semiconductor technologies. You will lead the design and development of sophisticated manufacturing processes, perform pathfinding activities for future device architectures, and collaborate with world-class suppliers and internal teams to push the boundaries of what's possible in semiconductor technology.

This is a unique opportunity to make a meaningful impact on Intel's strategic roadmap and the broader semiconductor industry.
*
* Key Responsibilities:

*** Technology Development & Enablement:
Drive technology development for high-volume manufacturing and future technology nodes, providing process integration and equipment solutions to meet desired device specifications.
* Process Design & Development:
Lead the design and development of technically sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
* Pathfinding & Roadmap Development:
Perform pathfinding activities in support of process and hardware development, enabling the manufacturing of innovative device architectures, and develop technology roadmaps for future product generations.
* Manufacturing Optimization:
Recommend and implement modifications to operating equipment to improve production efficiency, refine manufacturing techniques, and optimize production output for existing products.
* Supplier

Collaboration:

Partner with key equipment and materials suppliers to develop and implement enabling elements of technology, building cost-sensitive roadmaps in collaboration with the vendor ecosystem.
* Feasibility Studies:
Perform process technology feasibility studies through theoretical simulations and practical engineering methods to validate new approaches and technologies.
* Industry Awareness:
Remain current on relevant industrial process and material manufacturing technical trends, developing a forward-looking view of Intel's future process technology needs to push the industry forward.
* Statistical Analysis & Experimentation:
Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to drive data-informed decisions and process improvements.
* Automation & Systems Development:
Leverage hands-on experience with robotics, automation systems, vision systems, and image processing to advance manufacturing capabilities.
** As a Successful Candidate, You Will Bring:
*** A Natural Problem-Solver:
You thrive when faced with complex challenges and approach them with creativity, curiosity, and a structured mindset.
* Adaptable & Resilient:
You embrace change and ambiguity, pivoting quickly when priorities shift without losing momentum or focus.
* A Collaborative Team Player:
You build strong relationships across teams, functions, and supplier ecosystems, knowing that the best outcomes come from working together.
* An Effective Communicator:
You can translate complex technical concepts into clear, actionable insights for diverse audiences, from engineers to leadership.
* Self-Motivated & Driven:
You take ownership of your work, proactively seek out opportunities to improve processes, and are passionate about making a meaningful impact.
* Detail-Oriented:
You bring precision…
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