DIC Platform Wet and Plating Development Manager

Intel Foundry is seeking an exceptional Wet and Plating Module Development Manager to lead our Wet Etch/Clean as well as Plating technology development for 3

DIC platform. This role will drive the development and implementation of Wet Clean/Plating processes critical to Intel's industry-leading advanced packaging portfolio, including Foveros Direct, Foveros, and EMIB technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in Wet and Plating system optimization. This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.

• Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment
• Formulate long-term strategies for process roadmap to meet future requirements, ensuring Intel remains a leader in advanced packaging
• Oversee development of production-worthy wet etch/plating processes for high-volume manufacturing
• Foster talent development for critical technical roles, and drive technical excellence and innovation within the wet etch(clean)/plating team
• Develop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross-functional teams
• Drive Wet Etch(clean) and Plating module and segment related yield improvement initiatives and defect reduction programs
• Partner with process integration, manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high-volume manufacturing

• Excellent communication and collaboration skills to drive complex projects across diverse teams and stakeholders.
• Strategic mindset with a proven ability to solve complex technical challenges and implement process improvements to achieve business objectives.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

• Master or PhD degree in Chemistry, Materials Science, Physics, Electrical Engineering, Mechanical Engineering, or a related field, with 8+ years of relevant experience at a Master's degree, 6+ years or experience with a PhD degree.
• The experience listed above should include a combination of the following qualifications:
  Wet Etch/Clean or Plating experience and hands-on experience working with various wet etch and/or plating platforms.
• Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.

• Build and lead effective teams, including fostering an inclusive, productive, and innovative team culture.
• Rich experience with vendor relations, including material quality assessments and performance management.
• Strong knowledge of Design of Experiments (DOE) principles, problem-solving methodologies, and package interconnect technologies.

Experienced Hire

Shift 1 (United States of America)

US, Oregon, Hillsboro

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation,…