Intel Foundry Module Development Engineer – Advanced Wet Etch and Cleans

Shape the Atomic Frontier of Semiconductor Innovation At Intel Foundry Technology and Development (TD), we don't just participate in technology development; we engineer physical reality at the angstrom scale. We are seeking visionary, research-driven Ph.D. graduates in Chemical Engineering, Chemistry, Materials Science, Electrochemistry, and Engineering to spearhead the next breakthrough in semiconductor manufacturing. As a Wet Etch Module Development Engineer, you will operate at the intersection of fundamental chemical kinetics, interfacial surface science, and high-volume manufacturing engineering.

You will pioneer atomic-layer selective etching, nanoscale surface cleans, supercritical and surface-tension-engineered drying, wet chemical formulations, and advanced single-wafer wet tool architectures to define the future of global computing.

• Pioneer Next‑Gen Process Architectures:
  Formulate and execute rigorous Design of Experiments (DOE) to invent, characterize, and validate novel wet etch, selective removal, and advanced chemical clean processes that power world‑class transistor architectures (RibbonFET/GAA), backside power delivery networks (Power Via), and high‑density interconnect scaling
• Lead Hardware and Module Co‑Optimization:
  Collaborate with premier global semiconductor equipment suppliers and specialty chemical vendors to push single‑wafer and batch wet processing capabilities beyond conventional fluid‑dynamic and surface‑tension limits, co‑engineering custom dispense, megasonic, and chamber hardware solutions
• Harness AI and Scientific Computing:
  Integrate computational fluid dynamics (CFD), chemical kinetics modeling, statistical physics, and data science (Python, MATLAB, JMP, ML frameworks) to accelerate chemical formulation screening, surface defectivity reduction, and line‑yield enhancement
• Drive High‑Impact IP:
  Translate complex chemical, electrochemical, and surface phenomena into high‑value patents, trade secrets, and proprietary wet processing solutions that sustain Intel Foundry's technological leadership
• Scale Science to Global Manufacturing:
  Bridge early lab prototypes and coupon‑level studies to 300mm fab‑scale ramp, seamlessly deploying high‑throughput, defect‑free wet processes across Intel's worldwide mega‑fabs using our industry‑leading Copy Exactly (CE) methodology

• Access to Unparalleled Technology:
  Direct, hands‑on access to the industry's most advanced 300mm cleanroom facilities, state‑of‑the‑art single‑wafer wet processing platforms, and cutting‑edge analytical surface characterization suites
• Academic Rigor Meets Global Impact:
  The intellectual curiosity and depth of doctoral research combined with the scale, capital resources, and execution speed of an industry leader
• Accelerated Technical Leadership:
  Direct mentorship and collaboration with Intel Fellows and Senior Principal Engineers on an accelerated path toward technical distinction
• Comprehensive Total Rewards:
  Top‑tier Ph.D. compensation packages, sign‑on bonuses, annual performance bonuses, Employee Stock Purchase Plan (ESPP), equity/RSU grants, and full relocation assistance

• Ph.D. in Chemical Engineering, Chemistry, Materials Science and Engineering, Electrochemistry, Mechanical Engineering (Microfluidics/Transport Phenomena), Physics, or a closely related discipline (Degree completed or expected within 12 months)
• 2+ years of hands‑on experimental research experience (e.g., doctoral dissertation, advanced wet chemical synthesis/etching, aqueous/non‑aqueous solution chemistry, electrochemistry, surface functionalization, thin‑film interface phenomena, or cleanroom wet bench processing)