Foundry Module Development Engineer – Advanced Wet Etch and Cleans

Position: Intel Foundry Module Development Engineer – Advanced Wet Etch and Cleans
Job Details:

Job Description:

Shape the Atomic Frontier of Semiconductor Innovation At Intel Foundry Technology and Development (TD), we don't just participate in technology development; we engineer physical reality at the angstrom scale. We are seeking visionary, research-driven Ph.D. graduates in Chemical Engineering, Chemistry, Materials Science, Electrochemistry, and Engineering to spearhead the next breakthrough in semiconductor manufacturing. As a Wet Etch Module Development Engineer, you will operate at the intersection of fundamental chemical kinetics, interfacial surface science, and high-volume manufacturing engineering.

You will pioneer atomic-layer selective etching, nanoscale surface cleans, supercritical and surface-tension-engineered drying, wet chemical formulations, and advanced single-wafer wet tool architectures to define the future of global computing.

What You Will Do:

Pioneer Next-Gen Process Architectures:
Formulate and execute rigorous Design of Experiments (DOE) to invent, characterize, and validate novel wet etch, selective removal, and advanced chemical clean processes that power world-class transistor architectures (RibbonFET/GAA), backside power delivery networks (Power Via), and high-density interconnect scaling

Lead Hardware and Module Co-Optimization:
Collaborate with premier global semiconductor equipment suppliers and specialty chemical vendors to push single-wafer and batch wet processing capabilities beyond conventional fluid-dynamic and surface-tension limits, co-engineering custom dispense, megasonic, and chamber hardware solutions

Harness AI and Scientific Computing:
Integrate computational fluid dynamics (CFD), chemical kinetics modeling, statistical physics, and data science (Python, MATLAB, JMP, ML frameworks) to accelerate chemical formulation screening, surface defectivity reduction, and line-yield enhancement

Drive High-Impact IP:
Translate complex chemical, electrochemical, and surface phenomena into high-value patents, trade secrets, and proprietary wet processing solutions that sustain Intel Foundry's technological leadership

Scale Science to Global Manufacturing:
Bridge early lab prototypes and coupon-level studies to 300mm fab-scale ramp, seamlessly deploying high-throughput, defect-free wet processes across Intel's worldwide mega-fabs using our industry-leading Copy Exactly (CE) methodology

Why Join Intel Foundry TD?

Access to Unparalleled Technology:
Direct, hands-on access to the industry's most advanced 300mm cleanroom facilities, state-of-the-art single-wafer wet processing platforms, and cutting-edge analytical surface characterization suites

Academic Rigor Meets Global Impact:
The intellectual curiosity and depth of doctoral research combined with the scale, capital resources, and execution speed of an industry leader

Accelerated Technical Leadership:
Direct mentorship and collaboration with Intel Fellows and Senior Principal Engineers on an accelerated path toward technical distinction

Comprehensive Total Rewards:
Top-tier Ph.D. compensation packages, sign-on bonuses, annual performance bonuses, Employee Stock Purchase Plan (ESPP), equity/RSU grants, and full relocation assistance

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

Ph.D. in Chemical Engineering, Chemistry, Materials Science and Engineering, Electrochemistry, Mechanical Engineering (Microfluidics/Transport Phenomena), Physics, or a closely related discipline (Degree completed or expected within 12 months)2+ years of hands-on experimental research experience (e.g., doctoral dissertation, advanced wet chemical synthesis/etching, aqueous/non-aqueous solution chemistry, electrochemistry, surface functionalization, thin-film interface phenomena, or cleanroom wet bench processing)

Preferred Qualifications:

Demonstrated deep expertise in chemical reaction kinetics, selective wet etching, interfacial surface chemistry, corrosion/passivation mechanisms, or surfactant-assisted cleaning/drying mechanisms (e.g., Marangoni drying, supercritical (CO2), Surface modification (SMT))Hands-on experience with advanced thin-film, surface, and chemical characterization techniques…