Senior Advanced Packaging Module Engineer
Listed on 2026-10-20
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Engineering
Packaging Engineer, Manufacturing Engineer, Mechanical Engineer, Process Engineer
Intel Corporation in Hillsboro, Oregon seeks an Advanced Packaging Module Development Engineer to drive technology development for high-volume manufacturing and next-generation devices. You will lead design and development of sophisticated manufacturing processes, work with suppliers, and build roadmaps for future product generations.
The role emphasizes SPC/DOE, robotics and automation, and cross-functional collaboration across engineering teams.
As a Senior Advanced Packaging Module Engineer, you will play an important part at Intel Corporation in Hillsboro, OR, United States.
This role, Senior Advanced Packaging Module Engineer at Intel Corporation, could be your next move.
Are you ready to take on the Senior Advanced Packaging Module Engineer role at Intel Corporation?
We would love to welcome a new Senior Advanced Packaging Module Engineer to our group in Hillsboro, OR, United States.
For the Senior Advanced Packaging Module Engineer position at Intel Corporation, we are reviewing applications now.
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