System Technology Research Intern; Semiconductors
Listed on 2026-10-20
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Engineering
Electrical Engineering, Electronics Engineer
Intel Corporation in Hillsboro, Oregon, seeks a Research Engineer Intern to develop STCO methods and evaluate 3D/2.5D packaging schemes using solder microbumps or hybrid bonding for memory and logic stacking.
You will collaborate with diverse teams to design and simulate system architectures, evaluate devices and interconnects, and gain hands-on experience with cutting-edge semiconductor processing in a hybrid on-site/off-site role.
We would love to welcome a new System Technology Research Intern (Semiconductors) to our team in Hillsboro, OR, United States.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in Hillsboro, OR, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 142..
We aim to respond to suitable candidates as soon as possible.
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