Silicon Hardware Engineering Intern

This is an internship at Intel, primarily located in Hillsboro, OR, with additional opportunities in Phoenix, AZ, Folsom, CA, Santa Clara, CA, and Austin, TX. At Intel, you will contribute to building technologies that power the future of computing, ranging from advanced semiconductor manufacturing to AI-powered innovations. The company offers a unique opportunity to experience the entire technology lifecycle, from research and design to advanced semiconductor manufacturing and global deployment.

This role helps solve real-world challenges affecting billions by developing core technologies for processors and platforms, enabling a more sustainable and connected future.

• Role:
  Internship
• Type:
  Student / Intern
• Location:
  
  In-person Hillsboro, OR
• Pay: $91198-$91202 hourly
• Mission:
  Build technologies that power the future of computing and contribute to innovations in processors, GPUs, SoCs, photonics, and validation systems.
• Tech Stack:
  Scripting, data analysis, hardware validation methods

• Design:
  Design, build, and contribute to the architecture of silicon, circuits, logic, and physical layouts for Intel processors and platforms.
• Validate:
  Perform verification and validation activities for silicon architecture, circuit design, logic, layout, and physical design elements.
• Analyze:
  Test, analyze, and debug technologies at the core of Intel processors and platforms using scripting, data analysis, and hardware validation methods to solve technical problems.
• Collaborate:
  Collaborate across silicon, product, and manufacturing teams to ensure integrated development and contribute to innovations in processors, GPUs, SoCs, and photonics.
• Develop:
  Develop technical depth, tackle complex engineering challenges, and contribute to the evolution of validation systems from day one alongside experienced engineers.

• Background:
  Currently pursuing a Bachelor's degree in Computer Engineering, Computer Science, Electrical Engineering, Physics, or a related STEM field.
• Experience:
  
  3+ months of experience gained through coursework, academic projects, research, internships, co-ops, student organizations, or assistantships.
• Skills:
  
  Strong problem-solving, communication, and collaboration abilities, with the capacity to work effectively in team-based environments. Interest or foundational experience in areas such as silicon architecture, circuit design, logic, layout, physical design, verification, validation, or debug.
• Bonus: A GPA of 3.0 or higher. Hands-on coursework, research, projects, or internship experience related to the role family, or experience/interest in programming, scripting, data analysis, automation, modeling, or simulation.