Lead Principal Engineer, Die-to-Wafer Hybrid Bonding
Listed on 2026-10-21
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Engineering
Systems Engineer, Electrical Engineering
Intel Corporation in Hillsboro, Oregon seeks a Principal Engineer to define and scale next‑generation die-to-wafer hybrid bonding technologies for advanced packaging. You will drive technology roadmaps, mentor staff, and partner with equipment vendors to deliver robust, manufacturable solutions across TD and HVM environments.
You will contribute to process development, yield improvement, and reliability enhancements while aligning technical strategies with corporate goals and cost efficiency.
Are you ready to take on the Lead Principal Engineer, Die-to-Wafer Hybrid Bonding role at Intel Corporation?
The Lead Principal Engineer, Die-to-Wafer Hybrid Bonding role at Intel Corporation is now open for applications in Hillsboro, OR, United States.
Join us at Intel Corporation as our next Lead Principal Engineer, Die-to-Wafer Hybrid Bonding in Hillsboro, OR, United States.
We are currently recruiting a Lead Principal Engineer, Die-to-Wafer Hybrid Bonding for our team in Hillsboro, OR, United States.
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