Thin Films Module Engineering - PhD Intern

The Role and Impact As a Module Engineering PhD Intern, you will play a key role in developing and sustaining semiconductor manufacturing processes for a specific module. Your day-to-day responsibilities will include supporting equipment troubleshooting, performing maintenance and qualification activities, and collaborating with engineering teams to optimize process control methodologies. This role offers a unique opportunity to gain hands‑on experience in semiconductor manufacturing while building essential skills for a future career in engineering.

You will join the Intel Foundry team, a dynamic and innovative group dedicated to delivering cutting‑edge manufacturing solutions that drive Intel's technology forward. The team focuses on advancing semiconductor fabrication processes in areas such as Diffusion, Dielectrics, Implant, EPI, and FE Metals. As part of this group, you will contribute to Intel's mission of creating world‑changing technology that enables global progress and enriches lives.

As members of the Manufacturing Development and Customer Engineering (MDCE) team, we are responsible for improving process capability for multiple technology nodes (Intel 18A, Intel 3, Intel 12nm and upcoming technologies) from initial product qualification through high volume manufacturing. The focus will be on delivering yield improvement, performance enhancement, variation and cost reduction.

• Assist with the development and implementation of thin film manufacturing processes for a specific module within Intel's semiconductor production.
• Support troubleshooting and maintenance activities for manufacturing equipment to ensure optimal performance.
• Participate in equipment qualification processes, ensuring compliance with quality and functional standards.
• Collaborate with engineering teams to optimize process control methodologies and achieve production targets.
• Establish strong working relationships and partner closely with technology development, high volume manufacturing and cross‑functional stakeholders to achieve common goals.
• Analyze data trends, identify solutions for process improvement and drive automation improvements (using AI where applicable)
• Contribute to sustaining and improving manufacturing tools and processes while gaining hands‑on experience in semiconductor engineering.

• Currently pursuing a PhD degree in a relevant STEM discipline (e.g. Physics, Applied Chemistry, Chemical Engineering, Electronic Engineering, Mechanical Engineering, Computer Science, etc.).
• Strong analytical and problem‑solving skills.
• Experience writing software code for application in above majors.
• Excellent communication skills - both written and verbal.
• Ability to work independently and as part of a diverse, high‑performing team.
• Willingness to work in a cleanroom environment.
• Strong attention to detail and disciplined approach to procedures.
• Data analysis skills with demonstrated ability to construct clear data‑based problem statements, design of experiment.

• Experience with data analysis tools and software (e.g. JMP, Python, Excel, and AI tools).
• Ability to summarize data for technical and non‑technical audiences.

Please note, the ideal candidate will be open to work a 6‑month internship schedule beginning the Spring of 2027 through December 2027.

Job Type: Student / Intern

Shift: Shift 1 (United States of America) Primary

Location:

US, Oregon, Hillsboro Additional Locations:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition,…