Advanced Packaging Module Engineer – Wafer
Listed on 2026-11-04
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Engineering
Packaging Engineer, Electronics Engineer, Process Engineer, Manufacturing Engineer
Intel Corporation in Hillsboro, Oregon, is seeking an Oregon Advanced Packaging Module Engineer to drive high-volume packaging equipment and processes for next-generation ICs. You will design process controls, execute continuous improvement initiatives, and work on cutting-edge systems impacting Intel's production roadmap.
The role offers collaboration with global manufacturing sites, ownership of tooling ramps, and direct partnership with suppliers to optimize configurations for mass production
Are you ready to take on the Advanced Packaging Module Engineer – High-Volume Wafer role at Intel Corporation?
As a Advanced Packaging Module Engineer – High-Volume Wafer, you will play an important part at Intel Corporation in Hillsboro, OR, United States.
We invite applications for the Advanced Packaging Module Engineer – High-Volume Wafer position located in Hillsboro, OR, United States.
The following opening is for a Advanced Packaging Module Engineer – High-Volume Wafer with Intel Corporation.
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