Senior Advanced Packaging Module Engineer
Listed on 2026-11-04
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Engineering
Packaging Engineer, Electrical Engineering, Manufacturing Engineer, Process Engineer
Intel Corporation in Hillsboro, Oregon, seeks a Module Engineer to own high-volume packaging equipment and drive process development and control. You will work on cutting-edge semiconductor packaging, ensuring manufacturability and high-quality output.
The role emphasizes cross-functional leadership, problem solving with data, and adapting to a fast-paced manufacturing environment, with on-site work and strong career growth opportunities.
For the Senior Advanced Packaging Module Engineer position at Intel Corporation, we are reviewing applications now.
The Senior Advanced Packaging Module Engineer role at Intel Corporation is now open for applications in Hillsboro, OR, United States.
Join us at Intel Corporation as our next Senior Advanced Packaging Module Engineer in Hillsboro, OR, United States.
We are currently recruiting a Senior Advanced Packaging Module Engineer for our team in Hillsboro, OR, United States.
This is a great opportunity to take on the Senior Advanced Packaging Module Engineer role at Intel Corporation.
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