DIC Wet & Plating Tech Lead Advanced Packaging
Listed on 2026-10-19
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Manufacturing / Production
Manufacturing Engineer, Packaging Engineer
Intel Foundry is seeking a Wet and Plating Module Development Manager to lead Wet Etch/Clean and Plating technology development for 3
DIC platforms. This role manages a team of process engineers while contributing technically to process optimization.
The successful candidate will shape the technology roadmap, drive production-ready processes for high-volume manufacturing, and collaborate across functions to enable manufacturing excellence and seamless technology transfer.
This is a genuine opening to take on the 3
DIC Wet & Plating Tech Lead for Advanced Packaging role at Intel Corporation.
We are looking to fill the 3
DIC Wet & Plating Tech Lead for Advanced Packaging position at Intel Corporation in Hillsboro, OR, United States.
The 3
DIC Wet & Plating Tech Lead for Advanced Packaging role at Intel Corporation is now open for applications in Hillsboro, OR, United States.
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