Lead Scientist - Advanced Packaging & Chiplet Integration
Listed on 2026-10-30
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Science
Research Scientist
A
* STAR Research seeks a Scientist or Senior Scientist to advance 2.5D interposer and 3D stacking assembly processes for heterogeneous integration. You will drive micro-bump bonding and chip-to-wafer technologies, collaborating with design and wafer teams to set design rules and roadmaps.
The role requires a PhD and 5–10 years in semiconductor packaging, with demonstrated leadership in complex project execution and external partnerships across North America, Europe, and Asia.
Consider building your career as a Lead Scientist - Advanced Packaging & Chiplet Integration at A
* STAR Research.
This is a great opportunity to take on the Lead Scientist - Advanced Packaging & Chiplet Integration role at A
* STAR Research.
As a Lead Scientist - Advanced Packaging & Chiplet Integration, you will play an important part at A
* STAR Research in HI, United States.
We invite applications for the Lead Scientist - Advanced Packaging & Chiplet Integration position located in HI, United States.
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