Failure Analysis Engineer

Overview

We are seeking a highly skilled and motivated Failure Analysis Engineer (FAE) to join our team. The successful candidate will work directly with clients to ensure deliverables fall within the applicable scope and budget. We are seeking a highly skilled and motivated Senior Engineering Team Member to support the resolution of hardware issues related to our ESSN Server Products portfolio. The role involves close collaboration with customers, as well as internal teams including Foxconn R&D, Product Engineering, and Quality Engineering.

This position focuses on identifying elevated factory and field failure symptoms, conducting in-depth circuit failure analysis, and determining root causes, leading to corrective actions that improve product quality and customer satisfaction.

• Troubleshoots, debugs, and determines root cause at multiple system levels for customer devices.
• Analyzes circuits and topologies to identify marginal failure root causes.
• Drives recovery actions and repairs for failing devices.
• Engineering Investigations: Lead engineering investigations of significant customer field and factory escalations related to hardware issues, ensuring timely resolution.
• Customer Satisfaction & Quality Improvement: Enhance customer satisfaction and product quality by addressing hardware-related issues promptly and efficiently.
• Cross-functional Collaboration: Work directly with design and manufacturing teams to investigate hardware issues down to the component level.
• Internal
  
  Collaboration:
  
  Collaborate with multiple internal engineering disciplines (HW, SW, Diags, Quality, Product, Mechanical, Materials, Reliability) to resolve complex hardware issues.
• Capture Programs Support: Facilitate the execution of special capture programs such as Early Field Capture, Selective Field Capture, ORT, L6, L10, L11 Factory Operations, and RMA.
• Feedback & Process Improvement: Provide feedback to internal and external teams based on analytical findings to improve process and design methodologies.
• RMA & Service Support: Assist in communicating best practices for WW RMA & Service Centers to improve product knowledge and streamline operations.
• Operational Excellence: Promote “best practices” across WW Operational, RMA, and Service Sites, driving efficiencies and quality improvements.
• Miscellaneous Duties: Perform additional duties as required, based on business needs.

• Engineering Knowledge: Deep understanding of Industry Standard Servers & Storage architecture and peripherals.
• RMA & Service Manufacturing Expertise: Familiarity with PCA, system, and RMA & service manufacturing environments.
• Clear Communication: Strong verbal and written communication skills, with the ability to convey complex ideas effectively.
• Analytical Problem-Solving: Ability to isolate and resolve hardware failures, including safely injecting failures during debugging to pinpoint root causes.
• Linux Knowledge: Working knowledge of Linux commands and structures, including exposure to SEL and IPMI tools.
• Debugging Tools & Algorithm Development: Proficient in developing and debugging algorithms, creating test tools to assist with failure isolation, and documenting findings for team sharing.
• Strong understanding of semiconductor device physics, IC design, and fabrication processes.
• Experience with EDA (Electronic Design Automation) tools and layout editing software.
• Strong problem‑solving skills with the ability to diagnose and resolve complex circuit issues.

• Bachelor’s degree or higher in Electrical Engineering, Microelectronics, Physics, or a related field (or equivalent experience).
• Minimum of seven (7) years of experience in FA, at best with hands‑on experience in technique enablement and development of supporting HW for Fault‑Isolation and/or vacuum‑based microscopic systems (e.g., SEM, DMM).
• Technical
  
  Skills:
  
  Proven ability to debug complex hardware issues using logic analyzers, oscilloscopes, and other test equipment.
• Server Technology Knowledge: Familiarity with key server technologies such as x86 & ARM multi‑core processors, DDR4/5, NAND memory, PCI‑e protocols, SAS, SCSI, SATA,…