Lead Failure Analysis Engineer

Overview

We are seeking a highly skilled and motivated Lead Failure Analysis Engineer (FAE) to join our team. The successful candidate will work directly with clients to ensure deliverables fall within the applicable scope and budget. The FAE will coordinate between Foxconn Tianjin, Mexico and Durham service centers.

• Troubleshoots, debugs, and determines root cause at multiple system levels for customer devices.
• Analyzes circuits and topologies to identify marginal failure root causes.
• Drives recovery actions and repairs for failing devices down to component level.
• Develops, maintains, and improves all troubleshooting solutions within area or responsibility.
• Works with various engineering groups to determine if the data indicates a need for process/product improvement and provides input on improvement opportunities.
• Assists with the fabrication and development of new equipment, fixtures, and test programs.
• Improves the Failure Analysis Procedure and supports cross-training.
• Manage the relationship with the clients and in charge of client weekly/monthly/quarterly review meetings.
• Understand optical FI workflow and work with our PFA team to guide sample-preparation development.
• Create business presentation slides, spreadsheets, diagrams and service roadmaps to document as needs in Excel and MS Suite office.

• Familiarity with scripting languages for automation of processes/workflows- proficient in reading and interpreting assembly drawings, schematics, and board layout.
• Basic understanding of scan-chain based test Design for Testing (DFT) and some experience in operation Automated Test Equipment, Advantest 93k preferred.
• Excellent written and verbal communication skills, with the ability to effectively collaborate with multi-functional team(s).
• Ability to work effectively in a team-oriented environment and independently when needed.
• Experience in advanced technology nodes (e.g., 2nm or below).
• Strong understanding of semiconductor device physics, IC design, and fabrication processes.
• Experience with EDA (Electronic Design Automation) tools and layout editing software.
• Strong problem-solving skills with the ability to diagnose and resolve complex circuit issues.

• Bachelor’s degree or higher in Electrical Engineering, Microelectronics, Physics, or a related field (or equivalent experience).
• Minimum of seven (7) years of experience in FA, at best with hands-on experience in technique enablement and development of supporting HW for Fault-Isolation and/or vacuum based microscopic systems (e.g., SEM, DMM).
• Knowledge of failure analysis techniques and methodologies.