Field Applications Engineer: Die Bonding Systems
Listed on 2026-10-30
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Engineering
Field/Service Technician, Systems Engineer, Electronics Engineer, Telecoms Engineering
Mycronic USA is seeking an Applications Service Engineer (Field Based) to deliver remote and on-site technical support across the US, Canada, and Mexico. You will diagnose, repair, install, and optimize die-bonding equipment while providing customer training and technical guidance.
The role requires a engineering degree and 3–5 years of field service experience, with frequent travel and strong communication skills. Base salary is competitive with a comprehensive benefits package.
This is a strong opening to take on the Field Applications Engineer:
Die Bonding Systems role at Mycronic USA.
The Field Applications Engineer:
Die Bonding Systems position in the Engineering field is open for applications.
We have an opening for a Field Applications Engineer:
Die Bonding Systems in United States within Engineering.
This role, Field Applications Engineer:
Die Bonding Systems at Mycronic USA, could be your next opportunity.
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