Graduate Microelectronics R&D Intern: SoC Design & AI
Listed on 2026-10-15
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Engineering
Electronics Engineer, Research Scientist
Boeing invites PhD students to join the 10-12 week Graduate Researcher Program (GRP) in Engineering & Technology Innovation. This summer internship focuses on microelectronics tech development, design, and testing for aerospace systems.
The program blends real-world industry work with development programming, mentorship, and exposure to Boeing teams. Applicants should be in their first year by July 2027 and prepared for full-time summer work onsite.
Consider building your career as a Graduate Microelectronics R&D Intern:
SoC Design & AI at Boeing.
The Graduate Microelectronics R&D Intern:
SoC Design & AI role at Boeing is now open for applications in Huntington Beach, CA, United States.
Join us at Boeing as our next Graduate Microelectronics R&D Intern:
SoC Design & AI in Huntington Beach, CA, United States.
We are currently recruiting a Graduate Microelectronics R&D Intern:
SoC Design & AI for our team in Huntington Beach, CA, United States.
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