Digital CCA Design

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At Boeing, we innovate and collaborate to make the world a better place. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.

Boeing Defense, Space & Security (BDS) seeks a Digital CCA Design Engineer who is a subject matter expert in high-speed digital circuit design
, signal integrity analysis
, and electrical design to join our team in Huntsville, AL.

• Focus on electrical design, simulation, verification, and validation testing of high‑speed printed circuit board design and electronic system.
• Lead product development cycles.
• Collaborate with cross‑functional teams, including other engineering disciplines.
• Keep current on related industry best practices and technological advancements.

This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim or final U.S. Secret clearance post‑start is required.

• Years of relevant experience: 3+ for level 3, 5+ for level 4, 10+ for level 5.
• Experience using Electrical Design Automation (EDA) Tools such as Mentor Graphics, Altium, PSPICE to perform schematic capture, PCB design and layout, and circuit simulation.
• Experience designing, testing, and integrating a digital circuit card assembly (CCA).
• Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science.

• Expertise in Circuit Card Assembly (CCA) design.
• Experience with design concepts and techniques such as concurrent engineering and Design for Manufacture/Assembly (DFM/A).
• Hyper Lynx Signal Integrity and Power Integrity experience.
• Experience in high‑speed digital circuit design with ability to perform signal integrity simulations for multiple high‑speed standards like 100G Ethernet, DDR2/3/4, PCIe.
• Design experience and knowledge of Printed Wiring Boards (PWB), circuit card assemblies, rigid flex board, or harness.
• MSEE, MSCE.
• Previous experience related to aerospace design techniques.
• Ability to develop design verification plan and perform system integration.
• Processor board design or complex digital design including processor or FPGA System on a chip (SOC).
• Experience in circuit analysis in SPICE or similar tool like LTSpice, ICAP.
• Familiar with high‑speed serial interface protocol like ethernet, PCIe.
• Experience in FPGA sizing and power to support board design.
• Strong understanding of PCB in design for manufacturing (DFM).
• Experience performing post‑board layout signal integrity analysis.
• Experience with digital high‑speed design verification and validation including measurements.
• Ability to mentor others in digital high‑speed design and analysis.
• Experience using Siemens (formally Mentor Graphic) Expedition Tool.
• Ability to operate as lead of the electrical design team for complex custom electronic systems.
• Providing design guidelines and support for system architecture design, board layout, product bring‑up, debug, validation, and factory builds.
• Experience in Hardware‑Software Integration and Validation.
• Experience with electronics design and troubleshooting activities.

Level 3:
Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), computer science, engineering data science, mathematics, physics or chemistry (e.g. Bachelor) and typically 5 or more years’ related work experience or an equivalent combination of technical education and experience or non‑US equivalent qualifications. In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

Level 4:
Education/experience typically acquired through advanced technical education from…