Product Yield Enhancement Engineer, HBM

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Product Yield Enhancement (PYE) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer for Micron Technology, Inc., you will work with a team responsible for taking next generation H devices from design to mass production! You will focus on failure analysis of test, internal qualification, and RMA failures, allowing for enhanced product reliability, rapid production ramp and early time to market.

Your primary areas of responsibility will apply fault isolation with a combination of electrical and physical characterization techniques combined with data analysis to identify physical defects introduced by process level or assembly step. You will maintain an in-depth knowledge of HBM technology, testing methodology, assembly technology and fabrication process. Additionally, you will be responsible for presenting and coordinating failure analysis findings with Management, Product, Process, Assembly, and Global Quality teams!

• Perform Electrical Failure Analysis and Fault Isolation
• Operate uMate and Merlin bench test platforms
• Utilize fault isolation methods such as emission, laser techniques, and EOTPR
• Operate Hamamatsu iPHEMOS, Thermo Fisher ELITE and Thermo Fisher Meridian
• Characterize or model backend test, internal qualification, and RMA fail signatures
• Extensive understanding of physical and logical semiconductor design
• Use layout/schematic to aid in fault isolation and fail signature modeling
• Understand various PFA and de-processing techniques for failures
• Understanding fabrication process and package assembly
• In depth understanding of CMOS process fabrication levels, steps, and methodologies
• Knowledge of the steps and details involved in the package assembly flow
• Understand reliability concerns that can cause delayed breakdown fail signatures
• Extensive expertise with process and assembly related defects as well as their causes and effects
• Understand probe, backend test and qualification flows
• Communicate effectively with internal and external partners for failure analysis
• Generate organized and timely failure analysis reports with clearly communicated causes and effects
• Perform fab, probe, and backend data extractions to provide supplemental data

• Excellent problem-solving and analytical skills
• Strong grasp of concepts regarding thorough investigative procedure
• Computer aided layout and schematic experience
• Semiconductor process coursework and experience
• UNIX and programming experience
• Experience working in teams and ability to work well with others
• Solid GPA
• Course work in VLSI design and semiconductor device physics (preferred)
• Good communication skills

Micron benefits include medical, dental, vision plans and a robust paid time‑off program. For additional information regarding the benefit programs available, please see the Benefits Guide posted on

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.