Principal Design Engineer, TSV Packaging

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next‑generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.

We are seeking an experienced Design Engineer to join our TSV Packaging team. High‑performance memory devices like HBM, RDIMM/LRDIMM and CAMM modules, graphics GDDR packages and other Micron architectures require extensive engineering analysis and design to meet the mechanical requirements of the future. Finite element analysis of package design enables innovation and development of outstanding solutions to help foster our goals.

Utilization of FEA techniques and their application to our industry will make Micron more impactful and relevant. Key aspects of this role will be to innovate, influence, collaborate, partner, and implement.

• Stay up-to-date on semiconductor and advanced electronics packaging technologies like High Bandwidth Memory (HBM) and Flip Chip.
• Detailed understanding of thermal compression bonding process for chip‑on‑wafer and wafer‑to‑wafer hybrid bonding process and the corresponding Multiphysics mechanisms involved to capture in the simulation.
• Collaborate daily with global teams in product design, engineering, technology, and business units to analyze manufacturing processes using simulation.
• Understanding of packaging materials and their production processes. Work with internal/external vendors and testing labs to craft and implement effective testing procedures to characterize materials for simulation analysis.
• Maintain an understanding of measurement methodologies and coordinate measurement data collection of packages and packaging materials for correlation of simulation activities.
• Develop semiconductor packages with advanced EDA techniques and simulation tools like ANSYS, Icepak, Flotherm.

• 8+ years working experience in Mechanical and Thermo‑mechanical finite element analysis, modeling and validation of electronic packages in Semiconductor industry or equivalent.
• Engineering tools: ANSYS Workbench, APDL, Abaqus, ProE or equivalent experience, AutoCAD, Solid Works, MATLAB.
• M.S. / Ph.D. in Mechanical Engineering, Material science, or related Engineering field.
• Good documentation/reporting skills and the ability to build and improve simulation and procedures for accurate and repeatable results.
• Seeking a dedicated, motivated individual to balance tasks efficiently and work well in a team.

• Simulation, modeling, and analysis of thermos‑mechanical problems by multi‑physics with software like Ansys, COMSOL, etc.
• Proven academic training and research experience in Solid and fluid mechanics.
• Experience in performing fracture simulations for IC packages.
• Experience in semiconductor process simulation like wafer‑to‑wafer bonding process, thermal compression bonding process, mass reflow process, die ejection process, etc.
• Ability to bring to bear the distributed team members and develop new characterization methods for new designs.
• Knowledge in product reliability tests like thermal cycling, and other environmental stresses.
• Mechanical design capability (2D, 3D) with Solid Works, AutoCAD, etc.
• Data acquisition experience and numerical analysis proficiency in MATLAB, Excel, JMP, etc.

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