Principal TSV Packaging Design Engineer-FEA & Multiphysics
Job in
Idaho City, Boise County, Idaho, 83631, USA
Listed on 2025-12-17
Listing for:
Micron Technology
Full Time
position Listed on 2025-12-17
Job specializations:
-
Engineering
Systems Engineer, Engineering Design & Technologists, Mechanical Engineer
Job Description & How to Apply Below
A leading semiconductor company in Idaho City is looking for a Design Engineer to join its TSV Packaging team. This role involves extensive engineering analysis on high-performance memory devices and collaboration with global teams to develop innovative solutions. Candidates should have 8+ years of experience, strong finite element analysis skills, and an advanced degree in Mechanical Engineering. The position also offers a range of comprehensive benefits to support team members' well-being and future planning.
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