Principal Thermal Simulation Engineer, APTD

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.

The Thermal Simulation Engineer will be directly involved in developing new and derivative advanced memory (HBM) packaging technologies, driving Micron’s Thermal advantage by designing premier packages in the APTD team. In this position, you will be influencing the Product power maps, die and package architecture, and Si BEOL design rules, finding efficient package structure and materials to mitigate any potential hot spot issues.

The scope of your work will be to address all Thermal aspects of 2.5D and 3D advanced packaging development that are related to design, material and process interactions. In this position you will collaborate with package architecture and design, fab/package assembly process integration, BU teams, and customers. We are looking for a passionate, hard-working, and self-motivated individual with the ability to handle multiple tasks and use good time management while being a great teammate who is optimistic and responsible.

• Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High Bandwidth Memory (HBM), wafer to wafer (W2W), Chip-On-Wafer (COW), Flip Chip, Through Silicon Vias (TSV), etc.
• Work daily with multi-functional global teams, namely product design, product engineering, Technology Development, Business Unit, manufacturing, and external customers to fully understand the product thermal risks and help optimize the packaging design by simulation support.
• Work with internal/external vendors and testing labs to design and implement effective Thermal testing procedures to characterize materials for simulation analysis.
• Use advanced EDA techniques to develop innovative semiconductor packages and package systems using advanced design tools and thermal simulation applications such as ANSYS, Icepak, Flotherm, and evaluate new AI-assisted EDA tools as needed.
• Work with customers and propose new power maps and cooling solutions on SIP level that provide optimal memory performance.

• Detailed understanding of package thermal budget and thermal compression bonding process as well as Hybrid and other innovative bonding processing methods.
• 15 years working experience in relevant engineering areas with at least 10 years of experience on Thermal finite element analysis, modeling, and validation of electronic packages in the semiconductor industry.
• Experience with engineering tools such as ANSYS Workbench, APDL, Abaqus, ProE, AutoCAD, Solid Works, and MATLAB.
• M.S. or Ph.D. in Mechanical Engineering or Materials Science with focus on Thermal Engineering.

• Simulation, modeling, and analysis of thermal problems by multi-physics with Icepak, Flotherm.
• Ability to leverage global team members and develop new thermal characterization methods for new designs.
• Knowledge in product reliability tests like thermal cycling and other environmental stresses. Ability to understand if there is any power cycling vs Temp cycle Rel data correlation.
• Good documentation/reporting skills and the ability to build and improve simulation and procedures for accurate and repeatable results.
• Data acquisition experience, visualization techniques, and numerical analysis…