Process Integration Engineer - Advanced Packaging; .5D/3D
Listed on 2026-10-06
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Engineering
Process Engineer, Manufacturing Engineer, Packaging Engineer, Systems Engineer
Location: Idaho City
Micron Technology, Inc. is seeking a Process Integration Engineer in Advanced Packaging to drive the development of 2.5D/3D packaging architectures, HBM, and hybrid bonding.
You will work across engineering disciplines to create production-ready solutions and improve yield, performance, and reliability across complex package systems. The role emphasizes cross-functional collaboration, experimental design, and technology transfer to manufacturing.
The Process Integration Engineer
- Advanced Packaging (2.5D/3D) role at 1000 Micron Technology, Inc. is now open for applications in Idaho City, , United States.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Process Integration Engineer
- Advanced Packaging (2.5D/3D) role in the description above.
We appreciate your interest in this position.
Join 1000 Micron Technology, Inc. and contribute to our ongoing work.
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