Principal Application Engineer – Semiconductor Advanced

Principal Application Engineer – Semiconductor Advanced Package

Principal Application Engineer - Semiconductor Advanced Package

Irvine, California, Full Time. You will join our business unit, working with advanced packaging materials (adhesives, sealants, functional coatings) targeted at the semiconductor industry.

As a Principal Application Engineer, you will lead on both developmental and commercial products in semiconductor advanced packaging. You will serve as a technical authority on material application processes (wafer-level encapsulation, molding, etc.), collaborate with customers to solve process challenges, and drive adoption of new and existing solutions with clear value.

You will engage across R&D, manufacturing, and customer sites to ensure products meet performance requirements and are successfully integrated into customer processes.

Key Responsibilities / Duties

• Serve as technical lead for advanced packaging product lines: troubleshoot, optimize, and validate material application processes
• Provide deep application knowledge in semiconductor packaging (2.5D, 3D, via, interposer, etc.)
• Interface directly with customers to resolve product- or process-related issues, working hands-on to test and develop solutions
• Design experiments, run tests, and analyze data for material behavior, reliability, and process compatibility
• Ensure new and existing products deliver quantifiable value to customers (yield, throughput, cost)
• Solve fundamental technical challenges across product families using Client approaches
• Collaborate with internal teams (R&D, process engineering, quality, manufacturing) to transfer successful technologies
• Maintain expertise on industry trends in advanced packaging, materials, and processes
• Travel to customer sites or partner locations (up to 10%) as needed

Required Qualifications & Skills

• Bachelor's degree in Materials Science / Engineering, Chemical Engineering, Mechanical Engineering, or related field
• 10+ years experience in semiconductor advanced packaging environment (materials, adhesives, encapsulants, molding)
• Strong understanding of 2.5D / 3D packaging, wafer-level encapsulation, molding, underfills, interconnects, etc.
• Proven track record in taking a product from development through customer implementation
• Strong experimental design, analytical, problem-solving, and characterization skills
• Excellent verbal and written communication, able to interact with customers and present in group settings
• Ability to work independently and cross-functionally in a fast-paced environment
• High ownership, customer-oriented mindset, and ability to translate customer needs into technical solutions
• Proficiency with project management, time management, and meeting deliverables
• Willingness to travel up to 10%