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Semiconductor Advanced Packaging Engineer

Job in Irvine, Orange County, California, 92713, USA
Listing for: Intermedia Group Inc.
Full Time position
Listed on 2025-12-26
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer, Materials Engineer, Chemical Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 150000 USD Yearly USD 120000.00 150000.00 YEAR
Job Description & How to Apply Below

OPEN JOB:
Principal Application Engineer - Semiconductor Advanced Package

LOCATION: Irvine, California

Relocation Assistance Available

SALARY: $120,000 to $150,000

INDUSTRY: Manufacturing & Production

JOB CATEGORY: Engineering - Industrial / Manufacturing

This position is with our Adhesive Technologies business unit – where we empower our people to transform industries and provide our customers with a competitive advantage through adhesives, sealants and functional coatings.

What you’ll do
  • Technical service engineer who provides technical engineering support for the company's Advanced Packaging Material products and responsible for developing in depth application knowledge for the company's Electronics markets.
  • Primary responsibilities are technical leading on developmental and commercialized products by optimization of material application processes, and direct interaction with customers to troubleshoot and solve product and process related problems.
  • She/he ensures that new and existing products can be successfully employed by the customers in a manner that brings clear and identifiable value.
  • Solves technology‑specific fundamental problems associated with entire product lines and/or product classes by novel approaches to application process development, troubleshooting, and material characterization.
What makes you a good fit
  • Minimum of a bachelor’s degree in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or other related fields, with 10+ years of experience working in a chemical for semiconductor advanced packaging environment.
  • Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package
  • Expertise in wafer level encapsulation and molding process in semiconductor package
  • Have strong verbal communication skills one‑on‑one with colleagues/customers as well as in front of groups with solid interpersonal skills, with ability to work as a team member and independently on multi‑task assignments
  • Strong ownership and responsibility with customer‑oriented mindset and good understanding of customer request & culture
  • Effective in using project and time management skills to drive projects to completion and focus on commitment to deliver the highest level of quality work consistently
  • Traveling of up to 10% will be part of this role.
How to apply
  • Full MS WORD Resume
  • Required compensation
  • Contact information
  • Availability

Upon receipt, one of our managers will contact you to discuss in full.

JASON DENMARK

Recruiting Manager

INTERMEDIA GROUP, INC.

EMAIL:

LINKEDIN:

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