Semiconductor Advanced Packaging Engineer
Job in
Irvine, Orange County, California, 92713, USA
Listed on 2025-12-26
Listing for:
Intermedia Group Inc.
Full Time
position Listed on 2025-12-26
Job specializations:
-
Engineering
Process Engineer, Manufacturing Engineer, Materials Engineer, Chemical Engineer
Job Description & How to Apply Below
OPEN JOB:
Principal Application Engineer - Semiconductor Advanced Package
LOCATION: Irvine, California
Relocation Assistance Available
SALARY: $120,000 to $150,000
INDUSTRY: Manufacturing & Production
JOB CATEGORY: Engineering - Industrial / Manufacturing
This position is with our Adhesive Technologies business unit – where we empower our people to transform industries and provide our customers with a competitive advantage through adhesives, sealants and functional coatings.
What you’ll do- Technical service engineer who provides technical engineering support for the company's Advanced Packaging Material products and responsible for developing in depth application knowledge for the company's Electronics markets.
- Primary responsibilities are technical leading on developmental and commercialized products by optimization of material application processes, and direct interaction with customers to troubleshoot and solve product and process related problems.
- She/he ensures that new and existing products can be successfully employed by the customers in a manner that brings clear and identifiable value.
- Solves technology‑specific fundamental problems associated with entire product lines and/or product classes by novel approaches to application process development, troubleshooting, and material characterization.
- Minimum of a bachelor’s degree in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or other related fields, with 10+ years of experience working in a chemical for semiconductor advanced packaging environment.
- Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package
- Expertise in wafer level encapsulation and molding process in semiconductor package
- Have strong verbal communication skills one‑on‑one with colleagues/customers as well as in front of groups with solid interpersonal skills, with ability to work as a team member and independently on multi‑task assignments
- Strong ownership and responsibility with customer‑oriented mindset and good understanding of customer request & culture
- Effective in using project and time management skills to drive projects to completion and focus on commitment to deliver the highest level of quality work consistently
- Traveling of up to 10% will be part of this role.
- Full MS WORD Resume
- Required compensation
- Contact information
- Availability
Upon receipt, one of our managers will contact you to discuss in full.
JASON DENMARK
Recruiting Manager
INTERMEDIA GROUP, INC.
EMAIL:
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