Lab Technician, DPA; Destructive Physical Analysis | EAG Laboratories

Position: Lab Technician, DPA (Destructive Physical Analysis) | EAG Laboratories

Company Description

Eurofins Scientific is a global leader in analytical testing, operating over 950 labs in 60 countries with 65,000 employees. EAG Laboratories, part of Eurofins, offers advanced services in analytical chemistry, microscopy, surface analysis, and engineering sciences—including failure analysis, product reliability, and ATE testing. We support clients across the product lifecycle, from R&D to manufacturing. Serving diverse industries, EAG delivers expert insights and tailored solutions.

Our engineers and scientists collaborate with clients to solve complex challenges and deliver actionable results. We foster a growth mindset, empowering individuals to drive success while meeting evolving technological and business needs.

Job Description

The DPA Technician performs advanced analysis on integrated circuits, components, relays, connectors, and other electronic devices used in high reliability applications. This role requires a strong engineering mindset, high degree of attention to detail, ability to perform complex procedures, and hands‑on proficiency in destructive and non‑destructive techniques.

Essential Job Functions

• Perform Destructive Physical Analysis (DPA) investigations per MIL‑STD methods (e.g., MIL‑STD‑883, MIL‑STD‑750, MIL‑STD‑1580) to identify defects and assess reliability risks.
• Perform advanced analysis using optical/digital microscopy, SEM/EDS, X‑ray (2D/real‑time), and C‑SAM to characterize component construction and detect anomalies.
• Conduct cross‑sectioning, de‑lidding, chemical/plasma etching, hermeticity testing, and other physical analysis techniques.
• Support test plans for reliability assessments and root cause investigations in collaboration with multidisciplinary teams.
• Implement new techniques and bring new tools online to enhance lab capabilities.
• Analyze samples to identify failure initiation sites and construction anomalies.
• Generate detailed technical reports and present findings to internal teams and customers.
• Ensure compliance with industry standards (ISO, JEDEC, AEC, IPC) and customer specifications.
• Interact with other technicians and engineers; mentor team members on best practices.
• Maintain adherence to safety protocols, Technology Control Plan, and quality system requirements.
• Protect confidential information and proprietary processes.

Location

This role is located in Irvine, CA. While we are unable to provide relocation assistance, we encourage local candidates to apply.

Work Schedule

Mon‑Fri: 8:30 am‑5:30 pm (flexible)

Qualifications

This position works with companies that deal with defense‑related activities and is subject to ITAR (International Traffic in Arms Regulations). All considered applicants must be U.S. Persons as defined by ITAR:

U.S. Citizen

U.S. Permanent Resident (i.e., “Green Card Holder”)

Political Asylee or Refugee

Education and Experience

• AS degree in Electronics or other technical and science fields highly desired.
• 2+ years of direct experience in Destructive Physical Analysis (DPA), Semiconductor or Electronics Failure Analysis roles.

Job Knowledge, Skills, and Ability

• Expertise performing MIL‑STD test methods: MIL‑STD 883, MIL‑STD 750, MIL‑STD 1580.
• Knowledge of and handling of electronics, integrated circuits, and components (e.g., resistors, capacitors, transformers, connectors, printed circuit boards, etc.).
• High degree of manual dexterity.
• Meticulous, detail oriented and highly organized.
• Excellent written and verbal communication skills.

Hands‑on Experience and Expertise

• Optical and Digital Microscopy
• X‑ray (real‑time/2D)
• Scanning Acoustic Microscopy (C‑SAM)
• De‑lidding of Ceramic and Hybrid IC packages
• Chemical Etching (e.g., decapsulation, HF, BOE, delineation)
• Deprocessing and Parallel Lapping
• Plasma Etching (e.g., RIE, ICP, CF4, etc.)
• Glassivation integrity testing
• Cross‑Sectioning (e.g., metallurgical, mechanical, ion mill)
• Scanning Electron Microscopy (SEM)
• Energy Dispersive Spectroscopy (EDS)
• Wire Bond Pull Testing
• Die Shear Testing
• Fine/Gross Leak Testing
• Particle Impact Noise Detection (PIND)
• Dye Penetrant Testing

Highly Desired Skill and Knowledge

• Knowledge of other Industry Standards: e.g., ISO, AEC, JEDEC, IPC.
• Device physics, circuits/schematics,…