Principal Application EngineerSemiconductor Advanced

Principal Application Engineer – Semiconductor Advanced Package

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Irvine, California – Full time.

We are looking for a Principal Application Engineer who will work within our Semiconductor Advanced Packaging business unit, focusing on advanced packaging materials such as adhesives, sealants, and functional coatings targeted at the semiconductor industry. The successful candidate will contribute to innovation, process excellence, and customer impact through deep technical support, application development, and troubleshooting in advanced packaging markets.

As a Principal Application Engineer, you will lead on both developmental and commercial products in semiconductor advanced packaging. You will serve as a technical authority on material application processes (wafer‑level encapsulation, molding, etc.), collaborate with customers to solve process challenges, and drive adoption of new and existing solutions with clear value.

You will engage across R&D, manufacturing, and customer sites to ensure products meet performance requirements and are successfully integrated into customer processes.

Key Responsibilities / Duties

• Serve as technical lead for advanced packaging product lines: troubleshoot, optimize, and validate material application processes.
• Provide deep application knowledge in semiconductor packaging (2.5D, 3D, via, interposer, etc.).
• Interface directly with customers to resolve product‑ or process‑related issues, working hands‑on to test and develop solutions.
• Design experiments, run tests, and analyze data for material behavior, reliability, and process compatibility.
• Ensure new and existing products deliver quantifiable value to customers (yield, throughput, cost).
• Solve fundamental technical challenges across product families using client‑focused approaches.
• Collaborate with internal teams (R&D, process engineering, quality, manufacturing) to transfer successful technologies.
• Maintain expertise on industry trends in advanced packaging, materials, and processes.
• Travel to customer sites or partner locations (up to ~10%) as needed.

Required Qualifications & Skills

• Bachelor's degree in Materials Science/Engineering, Chemical Engineering, Mechanical Engineering, or related field.
• 10+ years of experience in semiconductor advanced packaging environment (materials, adhesives, encapsulants, molding).
• Strong understanding of 2.5D/3D packaging, wafer‑level encapsulation, molding, underfills, interconnects, etc.
• Proven track record in taking a product from development through customer implementation.
• Strong experimental design, analytical, problem‑solving, and characterization skills.
• Excellent verbal and written communication, able to interact with customers and present in group settings.
• Ability to work independently and cross‑functionally in a fast‑paced environment.
• High ownership, customer‑oriented mindset, and ability to translate customer needs into technical solutions.
• Proficiency with project management, time management, and meeting deliverables.
• Willingness to travel up to 10%.

Seniority level: Mid‑Senior level

Employment type: Full‑time

Job function: Engineering and Information Technology

Industries: Civil Engineering and Education Administration Programs