Lead Principal Packaging Engineer Gen RF
Listed on 2026-10-07
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Engineering
Packaging Engineer, Manufacturing Engineer, Process Engineer, Quality Engineering
Skyworks Solutions, Inc. is seeking a highly experienced Principal Engineer to lead development of advanced semiconductor packaging and assembly technologies for next-generation RF and wireless products. Irvine, CA is preferred, with exceptional candidates considered for other locations.
You will partner across design, manufacturing, suppliers, reliability, and customer teams to deliver high-performance packaging solutions that meet aggressive cost and quality targets.
Join us at Skyworks Solutions, Inc. as our next Lead Principal Packaging Engineer – Next-Gen RF in Irvine, CA, United States.
Please review the full job details above before applying.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in Irvine, CA, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 129..
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