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Senior Advanced Packaging & PDN Architect; .5D​/3D

Job in 20029, Turbigo, Lombardia, Italy
Listing for: Axelera AI
Full Time position
Listed on 2026-06-24
Job specializations:
  • Engineering
    Packaging Engineer, Systems Engineer
Job Description & How to Apply Below
Position: Senior Advanced Packaging & PDN Architect (2.5D/3D)
Location: Turbigo

Axelera AI in Turbigo is seeking a Senior Advanced Packaging & Power Delivery Engineer to shape silicon and packaging architecture for AI accelerators. You will manage power delivery design from on-die grids to package analysis.

The ideal candidate has 7+ years of experience in the semiconductor sector, demonstrated knowledge in advanced packaging, and effective cross-functional collaboration skills. Join us and help innovate in a dynamic environment offering flexible working options.
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Position Requirements
10+ Years work experience
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