Advanced Packaging Metrology Engineering Manager

## Advanced Packaging Metrology Engineering Manager Apply:
US, Oregon, Hillsboro:
Full time:
Posted Today:
End Date:
December 29, 2026 (30+ days left to apply):
JR0287424#
** Job Details:**##

Job Description:

Intel Corporation is a global technology leader at the forefront of semiconductor innovation, dedicated to creating world-changing technology that improves the lives of every person on the planet. Intel's Wafer-Level Assembly Technology Development (WATD) group is a dynamic, forward-thinking organization focused on developing next-generation packaging technologies. With a culture built on collaboration, inclusion, and relentless innovation, Intel offers an environment where your work truly matters — and where the future of technology is being written every day.  

We are seeking a visionary and technically accomplished Advanced Packaging Metrology Engineering Manager to lead a high-performing team of engineers at the cutting edge of advanced semiconductor packaging. In this pivotal role, you will drive innovation in wafer-level assembly technologies, champion manufacturing readiness, and deliver results that reinforce Intel's position as a global technology leader. You will shape the future of advanced packaging by enabling robust process pathways, executing long-term technology strategies, and cultivating a team culture rooted in excellence, accountability, and collaboration.

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* Key Responsibilities:

*** Lead and inspire a team of engineers to develop advanced wafer processing and packaging solutions that push the boundaries of semiconductor technology.
* Drive technology enablement, feasibility studies, and module improvement initiatives that align with Intel's strategic roadmap.
* Ensure successful demonstrations of manufacturing capabilities at high volumes and manage seamless technology transfers to global manufacturing sites.
* Partner with cross-functional teams — including integration, device, and yield engineering — to deliver process solutions that meet device specifications while optimizing safety, quality, and cost.
* Collaborate with supplier executive management to identify and implement innovative concepts into manufacturing processes.
* Execute long-term strategies for module engineering to support future technology needs and market demands.
* Set clear, measurable team objectives and apply differentiated performance management to consistently drive results.
* Coach, mentor, and develop engineers in skills growth, technology road mapping, and pathfinding for future innovations.
* Foster a collaborative, inclusive, and psychologically safe team environment that encourages bold thinking and accountability.  
** As a Successful Candidate, You Will Bring:
*** A Natural Leader — You inspire confidence, motivate teams, and bring out the best in the people around you.
* A Clear Communicator — You articulate complex ideas with clarity and adapt your communication style to diverse audiences.
* A Strategic Thinker — You see the big picture while staying grounded in the details that matter.
* A Collaborative Partner — You thrive in cross-functional environments and build strong relationships with stakeholders at all levels.
* A Coach and Mentor — You are genuinely invested in the growth and development of your team members.
* An Innovative Problem-Solver — You approach challenges with curiosity, creativity, and a solutions-oriented mindset.
* Resilient and Adaptable — You navigate ambiguity with composure and lead your team through change with confidence.
* Inclusive and Empathetic — You champion diversity of thought and create environments where everyone feels valued and heard.  Are you ready to lead a team that's shaping the future of semiconductor technology? Join Intel's WATD group in…