Senior Leader, Signal and Power Integrity​/Systems Architecture; -Speed Interconnects) San Diego, California, United

The
** Qualcomm Central Hardware Systems (CHS) team
** is seeking a
** Senior Leader, Electrical Systems Architect
** to define, develop, and productize next-generation high-speed electrical interconnect technologies for AI, hyperscale datacenter, networking, and HPC platforms.

The successful candidate will be a recognized technical leader with deep expertise in
** 224G/448G PAM4 signaling, Ser Des architectures, Signal Integrity (SI), Power Integrity (PI), advanced packaging, PCB design, connector technologies, and end-to-end electrical system analysis**. This role will drive architecture and technology decisions spanning silicon, package, PCB, power delivery networks, connectors, cables, CPC/NPC flyover solutions, and rack-scale systems.  
** Key Responsibilities
*** Define and drive end-to-end architecture for next-generation
** 224G and 448G PAM4 electrical interconnect systems**, including Ser Des, package, PCB, connector, cable, CPC, NPC, flyover, and rack-scale connectivity solutions.
* Lead system-level
** Signal Integrity (SI) and Power Integrity (PI)
** strategy, including channel budgeting, COM analysis, insertion loss, return loss, jitter, crosstalk, PDN design, and simulation-to-silicon correlation.
* Drive architecture, modeling, and optimization of high-speed link technologies spanning
** PHY/Ser Des architectures, equalization techniques, FEC, channel operating margins, and system performance tradeoffs
** across bandwidth, reach, power, latency, and reliability.
* Partner across silicon, package, board, power, and system teams to develop and productize advanced electrical connectivity solutions leveraging
** advanced packaging, CPC/NPC flyover architectures, and next-generation PCB technologies**.
* Provide technical leadership for future interconnect roadmaps, enabling scalable AI infrastructure through innovations in
** 224G/448G signaling, SI/PI methodologies, heterogeneous integration, and end-to-end electrical system design**.  
*
* Required:

*** MS or PhD in Electrical Engineering, Computer Engineering, Physics, or related discipline.
* 15+ years of experience developing high-speed communication, networking, or datacenter infrastructure products.
* Demonstrated success productizing
** 112G and/or 224G PAM4 electrical communication systems**.  
** Technical Expertise
** Deep expertise in:
* High-speed Ser Des architectures
* PAM4 communication systems
* Signal Integrity (SI)
* Power Integrity (PI)
* Package, PCB, connector, and cable design
* Power delivery network architecture
* Advanced packaging technologies
* Channel modeling and compliance methodologies
* End-to-end electrical system architecture
* AI networking, scale-up, and scale-out infrastructures  Hands-on experience with:
** ADS, HFSS, CST, HSPICE, MATLAB, Python, Cadence Sigrity, PowerSI, Clarity, System Verilog, Verilog-A, COM analysis tools, IBIS-AMI modeling*
* ** Preferred Qualifications
*** Experience developing and productizing
** 224G+ and 448G electrical interconnect solutions**.
* Experience with
** CPC, NPC, copper flyover architectures, AECs, advanced package substrates, and next-generation PCB technologies**.
* Familiarity with
** Ethernet, PCIe, UALink, NVLink, OIF CEI, IEEE 802.3, and AI networking fabrics**.
* Experience with
** chiplets, UCIe, heterogeneous integration, EIC/PIC interfaces, and advanced packaging technologies**.
* Track record influencing technology roadmaps, industry standards, and large cross-functional architecture decisions.
* Proven technical leadership and mentorship of senior engineering teams.
*
* Minimum Qualifications:

*
* • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 10+ years of System/Package Design/Technology Engineering or related work experience.
OR   Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 9+ years of System/Package Design/Technology Engineering or related work experience.
OR   PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ year of System/Package Design/Technology Engineering or related work experience.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disabili or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide…