Principal PCB Design Engineer

Radar Reinvented.

Echodyne offers the world’s first compact solid-state true beam-steering radar for a wide range of industries and applications. Our high-performance radars work in all weather and are designed for autonomous vehicles, uncrewed aircraft & drones, and security of borders, critical infrastructure, and smart cities. The company combines the patented technology of metamaterials with powerful software to create a radar sensor with unprecedented performance at commercial price points.

Echodyne offers its radars to companies working in Automotive, Transportation, Critical Infrastructure Protection, Border Security, Smart Cities, Uncrewed Aircraft Systems (UAS), and Airspace Management including Urban Air Mobility (UTM).Principal PCB Design Engineer Advanced Technology Development ROLE OVERVIEWEchodyne is seeking a Principal PCB Design Engineer to join the Advanced Technology Development team and lead physical design for demanding RF, high-speed digital, mixed-signal, and power electronics used in rapid radar prototypes and future products.

You will join a high-performing, cross-disciplinary team where senior engineers have meaningful technical ownership, run fast experiments, and see their work move directly into future radar products. You will work on prototype development, including tiled-aperture electronics, distributed beam control, modular RF and compute hardware, and fast calibration and test infrastructure.

The ideal candidate combines deep PCB design expertise with sound technical judgment, close supplier engagement, and the ability to balance electrical performance with reliable, repeatable manufacturing.

RESPONSIBILITIES Lead PCB physical design for advanced technology prototypes, advanced test vehicles, and future high-performance radar platforms

Translate RF, antenna, analog, high-speed digital, power, mechanical, and manufacturing requirements into practical stackups, constraints, placement, routing, and interconnect solutions

Create prototype boards, coupons, and test vehicles that prove new materials, structures, fabrication methods, and assembly approaches

Collaborate with RF, electrical, mechanical, systems, manufacturing, suppliers, and key stakeholders to deliver mission-critical hardware within demanding engineering constraints

Apply modern best-practices and establish reusable guidance for design for manufacturing (DFM), design for assembly (DFA), design for test (DFT), reliability, stackups, and known layout limits

Provide Principal-level leadership through design reviews, supplier collaboration, mentoring, hands-on prototype bring-up, and transition of proven PCB solutions into product development REQUIRED SKILLS / EXPERIENCE Strong hands-on experience designing complex multilayer PCBs for RF, high-speed digital, mixed-signal, analog, or power applications

Advanced proficiency with Altium Designer or an equivalent PCB design platform, including constraint management, library use, fabrication outputs, and design review

Strong knowledge of stackups, controlled impedance, return paths, via structures, interconnects, laminates, finishes, tolerances, and PCB fabrication processes

Practical command of signal integrity, power integrity, EMI and EMC, thermal behavior, reliability, design for manufacturing, design for assembly, and design for test Experience translating schematics, performance budgets, and interface requirements into manufacturable placement and routing decisions

Experience working directly with PCB fabricators, assembly suppliers, materials and process engineers, and prototype build teams

Ability to communicate design decisions, constraints, and risks clearlyDESIRED SKILLS / EXPERIENCE (Looking for one or more as a complement to the core skills) Experience developing PCB technologies for radar, phased arrays, aerospace, defense, sensing, or other high-reliability and mission-critical products

Experience in advanced technology development, applied research, rapid prototyping, or early hardware technology maturation

Experience with antenna or RF-aperture PCB implementation, HDI, high-layer-count boards, rigid-flex, flex circuits, PTFE, mixed-material stackups, or metal-backed boards

Experience laying out high-speed data converters, clock and frequency-synthesizer circuits, down conversion chains, FPGA or SoC interfaces, or high-current power distribution

Competence with analysis tools such as Ansys Electronics Desktop, SIwave, High Frequency Structure Simulator (HFSS), Hyper Lynx, Sigrity, or…