Advanced Packaging Engineer

200 Neo City Wy, Kissimmee, FL 34744, USA

Posted Tuesday, December 9, 2025 at 6:00 AM

Bold Thinking. World Changing. At Sky Water, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world.

Explore what’s possible. Joining our U.S.

- based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro‑mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few.

Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.

Step into the future. Sky Water’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.

Are you bold thinking? Find your place on our team and help us change the world!

Position Summary:

We are seeking a highly skilled and motivated Advanced Packaging Engineer with hands‑on experience in relevant technologies. The successful candidate will be responsible for the development, optimization, and sustaining of advanced packaging solutions.

Key Responsibilities:

• Lead process development and optimization of IC packaging processes (e.g., compression mold, ball attach, laser groove, dicing, die attach, tape & reel, back grinding / thinning).
• Define and execute DOE (Design of Experiments) for new materials and process evaluations.
• Establish process windows and control limits; develop process documentation including FMEA and control plans.
• Support new product introductions and ramp to production by collaborating closely with manufacturing and Product teams.
• Identify root causes and drive corrective actions for yield and reliability issues.
• Troubleshoot process issues, providing continuous improvements to yield, quality, and cycle time.
• Work with tool vendors and material suppliers to develop next generation technologies.
• Maintain clear documentation of process changes, results, and improvements through review & control processes.
• Present findings and suggest improvements to leadership teams.

Required Qualifications:

• At least 5-10 years of hands‑on experience in semiconductor packaging process development (e.g., compression mold, ball attach, laser groove, dicing, die attach, tape & reel, back grinding / thinning).
• Knowledge of JEDEC reliability testing and associated failure modes & remedies.
• Familiarity with materials used in FOWLP/FOPLP ball attach and RDL is an added advantage.
• US Citizenship
  
  Required:
  
  This position will require the holding of or ability to obtain government security clearance which requires U.S. Citizenship.
• Solid understanding of failure analysis and troubleshooting with 8D, Six sigma processes.
• Strong problem‑solving skills and a detail‑oriented approach is needed.
• Ability to communicate technical concepts clearly to both technical and non‑technical stakeholders.
• Strong teamwork, collaboration, and interpersonal skills is required.
• Ability to work in a fast‑paced, cross‑functional team environment.
• BS degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or a related field, MS or PhD degree is a plus.

The annual salary range for this role is $110,000 - $165,000. Pay offered is based on many factors including, but not limited to, the job‑related experience, skills, education, and credentials of each…