Wafer Bonding Engineer

Wafer Bonding Engineer at Sky Water Technology

Bold Thinking. World Changing. At Sky Water, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life‑saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world.

Explore what’s possible. Joining our U.S.

-based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro‑mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few.

Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.

Step into the future. Sky Water’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.

Are you bold thinking? Find your place on our team and help us change the world!

We are looking for a Bonding Process Development Engineer for our Florida Advanced Packaging site. In this role, you will lead, develop, and improve permanent and temporary bonding for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan‑Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

• Develop and temporary bonding and debonding capabilities for advanced packaging processes using spin‑on polymers, laser debond films and tapes.
• Define and maintain automated and manual processes in tape application and temporary bond material deposition.
• Develop and maintain processes in permanent bonding using wafer to wafer techniques such as Hybrid Bonding/DBI.
• Coordinate with appropriate engineering areas to support integration of your processes for bonding and debonding.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in‑line and end‑of‑line SPC charts and defects for trends or excursions that can be addressed by integration changes.

The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Education: BS Engineering (4 years), MS/PhD preferred (2 years)

• Fab processing tools knowledge/experience and how to support defect feedback to process owners.
• 2‑4 years of engineering experience.
• MEMS/CMOS/Packaging bonding knowledge with relevant combination of years of experience and/or advanced degree.
• Knowledge of DOE, SPC, and 6‑sigma concepts and applications.
• Project Management skills and/or defined training a plus.
• Clear problem‑solving capability, data‑driven, inventive solution oriented and can articulate thought processes.
• Can work both independently and in cross‑functional teams for problem solving.

This position will require the holding of or ability to obtain government security clearance which requires U.S. Citizenship.

The annual salary range for this role is $91,600 - $137,400. Pay offered is based on many factors including, but not limited to, the job‑related experience, skills, education, and credentials of each candidate.

Sky Water…