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Packaging Engineer Manufacturing Engineer

Wafer Bonding Engineer — Advanced Packaging & 3D ICs

Job in Kissimmee, Osceola County, Florida, 34747, USA
Listing for: SkyWater Technology
Full Time position
Listed on 2025-12-31
Job specializations:
  • Engineering
    Packaging Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 91600 - 137400 USD Yearly USD 91600.00 137400.00 YEAR
Job Description & How to Apply Below
A leading semiconductor manufacturer is seeking a Wafer Bonding Engineer for its Florida Advanced Packaging site. The role involves developing bonding and debonding capabilities for advanced packaging processes. Candidates must have a BS in engineering, 2-4 years of engineering experience, and knowledge of MEMS/CMOS packaging. The position offers a competitive salary range of $91,600 - $137,400 and generous benefits including 401k matching and comprehensive health coverage.
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