Advanced Packaging Microelectronic Process Integration Engineer

Bold Thinking. World Changing. At Sky Water, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world.

Explore what’s possible. Joining our U.S.

- based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few.

Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.

Step into the future. Sky Water’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.

Are you bold thinking? Find your place on our team and help us change the world!

Position Summary:

We are looking for a hardworking, and passionate experienced Process Integartion Engineer for our Florida Advanced Packaging site. In this role, you will lead, develop, and improve an overall integrated Advanced Packaging process flow. Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

Major Areas of Accountablity:
• New process development/transfer/integration in a manufacturing environment.
• Develop or integrate robust manufacturable process recipes for Foundry customers in one or more of metal deposition, dielectric deposition, photo, etch, or CMP areas.
• Process integration for MEMS/Photonic devices advanced packaging backend of line.
• Utilize metrology tools to characterize process conditions and document results.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in line and end of line SPC charts for trends or excursions that can be addressed by integration changes.
• Monitor and improve electrical test para metrics.
• Could develop into a Project Management position integrating Customer device requests.

The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position. Required

Required Qualifications:

Education:

BS Engineering, MS/PhD preferred

Experience and Skills:

• 10+ years of Process Development & Integration Engineer experience in Advanced Packaging Fab environment of 10K and 1K clean rooms related to Silicon Interposer and Bonding.
• MEMS/Photonic device and integration knowledge with relevant combination of years of experience and/or advanced degree.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Project Management skills and/or defined training a plus.
• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
• Can work both independently and in cross-functional teams for problem solving.

US Citizenship

Required:

This position will require the…