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Job Description & How to Apply Below
Responsibilities
- Drive the design, integration, and validation of advanced R&D equipment for thin‑film processing, taking independent ownership of long‑term projects and major mechanical sub‑systems
- Act as technical Lead & Responsible Engineer (RE): provide technical leadership on complex, cross‑functional projects, leading small project groups and serving as a discipline‑specific advisor
- Solve highly complex problems: address ambiguous technical challenges impacting multiple groups, proactively removing project barriers and generating novel solutions
- Plan & organize milestones: generate detailed work plans and milestones for complex and semi‑ambiguous hardware developments
- Standardize best practices & policies: drive continuous process improvement, tool development, and department policies using semiconductor standards as your guide
- Manage project risk: independently manage medium risks, identify larger system risks, and drive the development of robust mitigation solutions
- Collaborate & influence: build strong relationships across departments, effectively communicating highly complex concepts to diverse audiences and resolving cross‑functional conflicts to achieve alignment
- Mentor talent: actively mentor junior colleagues, taking direct ownership of their technical growth and skill development
- Deliver with speed: translate system‑level requirements into innovative concepts, driving projects efficiently from initial design through assembly, testing, and implementation
- Ability to occasionally lift up to 50 lbs
- Perform activities such as stooping, climbing, standing, or sitting for extended periods of time
- Dedication to safety to mitigate industrial hazards that may include heat, cold, noise, fumes, strong magnets, lead (Pb), high voltage, and cryogenics
- Willingness to travel or work required nights/weekends/on‑call occasionally
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