Mechanical and Thermal RF Engineer

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12 is one of the world’s fastest-growing aerospace companies, evolving from its pioneering use of 3D printing technologies for high-performance Radio Frequency (RF) products and applications to recently announcing the manufacture of entire geostationary telecom satellites, called Humming Sat, that define a new category in space.

Humming Sat is the world’s first commercial telecom GEO Small Sat developed in collaboration with the European Space Agency (ESA). Its uniquely compact size combined with highly capable telecom payloads allows telecommunications operators to deploy a cost-efficient, compact, and agile asset without sacrificing performance or security. Humming Sat has been selected by Intelsat to build the I-45 satellite, by Inmarsat to build three I-8 satellites, and recently by Astrum Mobile to build the NEASTAR-1 satellite.

SWISSto
12 is also a leading provider of Radio-Frequency (RF) products and sub-systems for satellite communication and remote sensing applications. The company’s patented 3D printing technologies and associated product designs are unique to deliver lightweight, compact, highly performing, and competitive RF products.

• At least 3 years demonstrated professional experience in structural and thermal design and analysis of spacecraft electronic equipment and/or major sub-assemblies for space applications or experience in mechanical and thermal analysis of mass efficient equipment for high performance applications typified by aerospace, defense,and motor sport.
• Proficient in the use of one or more of the following engineering tools for structural and/or thermal analysis:
  
  Hypermesh, FEMAP, Ansys Mechanical, ESATAN-TMS, Thermal Desktop, Opti Struct or equivalent.
• Strong working knowledge of analysis methodologies as applicable to aerospace applications.
• Familiarity with industry standards such as ECSS, MIL-HDBK5/17, NASA etc.
• Prior experience undertaking testing and model correlation for vibration and thermal vacuum testing.
• Ability to use CAD tools with an emphasis on geometry preparation for analysis.
• Organized, methodical, precise, meticulous, and autonomous person able to work across multiple concurrent work streams.
• Ease of communicating effectively, good interpersonal skills and ability to integrate into a multidisciplinary and multicultural team.

• Prior experience with analysis of high-power electronic equipment, including PCB level structural, thermal, and fatigue analysis.
• Experience working with PCB, RF, and/or antenna designers and exposure to PCB layout and PCB mechanical and thermal design.
• Good if the candidate has worked on phased array antenna product.
• Basic proficiency with one or more programming languages for the purpose of analysis data processing, e.g.
• Python, MATLAB, Perl, VBA etc.
• Prior ownership of a complex component or assembly from initial design through high-volume production.
• Experience with tools for electronics thermal design such as Flotherm or Icepak.

• Define, perform, validate, and document structural and thermal analysis using appropriate methodologies which may include a combination of classical hand calculations, empirical, and finite element analysis approaches.
• Build, run, and post-process detailed and idealized finite element models of sub-assemblies and components subjected to static, dynamic, and thermal loading.
• Provide practical support to hardware development and testing activities in addition to defining test plans and procedures, undertaking test predictions, and completing post-test model correlations.
• Collaborate with design and systems engineers to iterate designs using appropriate sizing methods to enable a‘Design-by-analysis’ approach.
• Review and assess…