Job Description & How to Apply Below
Lead advanced package design for ASICs ve a talented team in creating flip-chip-BGA packages that excel in high-speed Ser Des and power delivery needs.
As an IC Package Design Manager, you will oversee engineers developing complex designs for AI, networking, and 5G applications. This role demands a deep understanding of package design methodologies and project management skills to ensure timely delivery of high-performance solutions. You will play a crucial role in guiding your team and collaborating with vendors and cross-functional teams.
Key Responsibilities:
• Support team development and productivity metrics
• Manage project plans for multiple ongoing designs
• Organize customer and team activities for project success
• Communicate design plans and risk assessments
• Develop technical methodologies and design rules
Requirements:
• 12+ years in flip-chip-BGA design and 3+ years in management
• Expertise in high-speed Ser Des and power integrity
• BSEE/MSEE or related degree
• Strong self-management and organization skills
• Effective communicator in diverse teams
At Broadcom, harness your technical leadership to innovate in package design for cutting-edge technologies.
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