Principal Application Engineer

We're looking for a Principal Applications Engineer to join a next-generation Advanced Packaging team. This is a hands‑on technical leadership role supporting cutting‑edge packaging technologies for customers in the semiconductor industry.

Our client is a well‑established player in the semiconductor industry, developing equipment and process solutions for next‑generation advanced packaging technologies. They partner with major foundries, OSATs, and IDMs worldwide to advance the state of the art in chip packaging and heterogeneous integration.

• Lead applications engineering and process integration efforts for advanced packaging platforms
• Provide technical leadership on wafer bonding/debonding, RDL, WLP/PLP, and hybrid bonding processes
• Partner cross‑functionally with process, equipment, and customer engineering teams to troubleshoot and optimize process performance
• Support lithography and photolithography process integration within advanced packaging flows
• Serve as a key technical resource for customer engagements, escalations, and next‑gen technology development

• Strong background in advanced packaging, wafer bonding/debonding, RDL, WLP/PLP, hybrid bonding, or related process integration disciplines
• Experience with lithography/photolithography process steps a strong plus
• Prior experience at a leading OSAT, foundry, IDM, or semiconductor equipment/materials company
• Bachelor's degree or higher in Engineering, Materials Science, or related field, with significant relevant industry experience
• Strong communication and cross‑functional leadership skills

• This role is based on-site in Missouri; relocation assistance is available for the right candidate.

• No visa sponsorship is available at this time, and none will be available in the future for this role. Candidates must be authorized to work in the U.S. without current or future sponsorship.