Plasma​/Dry Etch Manufacturing Process Engineer

Job-:
Manufacturing

Location:

Lehi, UT, United States Posted:
Shift/

Work Schedule:

1stECL/GTC

Required:

Yes Change the world. Love your job. We're at the forefront of an exciting era of growth and innovation at LFAB (Lehi Fab), where our state-of-the-art 300mm, 65nm, 45nm and 28nm analog and embedded wafer manufacturing facilities are driving production of a diverse semiconductor portfolio in the heart of the Silicon Slopes. As we continue to expand we're seeking an experienced Dry Etch Process Engineer with expertise in 28nm or equivalent advanced node technologies to drive our new technology ramp.

At full production, our wafer fabs will manufacture tens of millions of analog and embedded processing chips every day and power electronics everywhere, supporting customer demand for decades to come. We're committed to responsible, sustainable manufacturing and making a meaningful impact on the local community through job creation and substantial investments in K-12 STEM education. In this role, you will be part of the factory team that will lead the activities ramp of our latest 28nm technology to yield entitlement, helping shape the future of the semiconductor industry.

The responsibilities of a Manufacturing Process Engineer in this role include:

Support manufacturing operations

Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality

Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements

Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous manner

Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
Participate in data analysis and problem resolution

Qualifications

Minimum requirements:

5 years of experience within Dry/Plasma etch process engineering

Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field

Strong foundation in statistical process control, engineering change control and process release strategies

Experience with 28nm and below

Preferred qualifications:

Demonstrated strong analytical and problem solving skills

Strong verbal and written communication skills

Ability to work in teams and collaborate effectively with people in different functions

Strong time management skills that enable on-time project delivery

Demonstrated ability to build strong, influential relationships

Ability to work effectively in a fast-paced and rapidly changing environment

Ability to take the initiative and drive for result

Experience with FEOL Isolation and Gate Etch Processing- STI, GATE, Contact, Flash integration methods.

Experience with BEOL Via/Trench Etch processing.

About the organization TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.

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