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ALD Thin Film Process Development Engineer

Job in Lehi, Utah County, Utah, 84043, USA
Listing for: Texas Instruments Incorporated
Full Time position
Listed on 2026-10-25
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer, Quality Engineering, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 90000 - 140000 USD Yearly USD 90000.00 140000.00 YEAR
Job Description & How to Apply Below

Texas Instruments' Advanced Technology Development team is looking for an energetic engineer with a passion for process development. This position provides the opportunity to enable new technologies for future Texas Instruments revenue growth. We are searching for a self-directed, highly motivated engineer to join our Lehi, UT Process Development team.

The responsibilities of a Process Development Engineer in this role include:
  • Develop new processes and define processing and equipment requirements, specifications, and manufacturing methods for advanced semiconductor applications.
  • Influence process integration schemes and support technology development from early paper studies and pilot work through full-scale manufacturing.
  • Translate business unit roadmap requirements into pathfinding and process development projects.
  • Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications
  • Lead or support projects involving new process concepts, equipment selection, chemistry development, automation technologies, and novel manufacturing approaches.
  • Provide technical engineering support in manufacturing and drive process and equipment modifications that improve production efficiency, technical capability, and yield.
  • Develop and apply statistical methods, including Design of Experiments (DOE) and Statistical Process Control (SPC), to identify physical causes of yield loss and improve quality.
  • Partner with equipment suppliers and vendors to define and execute equipment and process development roadmaps.
  • Work across 300mm deposition platforms, including current single-wafer ALD and CVD systems.
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