Principal​/Senior Principal Electromechanical Design Engineer

At the heart of Defining Possible is our commitment to missions. In rapidly changing global security environments, Northrop Grumman brings informed insights and software-secure technology to enable strategic planning. We’re looking for innovators who can help us keep building on our wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies that fuel those missions. By joining in our shared mission, we’ll support yours of expanding your personal network and developing skills, whether you are new to the field, or an industry thought leader.

At Northrop Grumman, you’ll have the resources, support, and team to do some of the best work of your career.

Northrop Grumman Mission Systems is seeking a Principal/Senior Principal Electromechanical Design Engineer to join our team of qualified, diverse individuals. This position will be located in Linthicum, Maryland and will require 100% on-site work.

• Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
• Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
• Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints.
• Providing technical leadership and mentoring to less experienced personnel.

This position may be filled as a Principal Electromechanical Design Engineer or a Senior Principal Electromechanical Design Engineer.

This position is contingent upon contract award and the ability to obtain an active DoD Secret Clearance or the successful transfer of an active DoD Secret Clearance prior to start.

• Bachelor’s degree with 5 years of experience, a master’s degree with 3 years of experience or a PhD with 1 year of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement
• U.S Citizenship is required.
• The ability to obtain/maintain a DoD Active Secret clearance.
• A current/active clearance is not required to be considered for the position, but a final clearance is required to start
• Experience with PWB/CCA design and signal routing, including chip-scale packaging technologies and substrate WB layout
• Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
• Proficient with AutoCAD and/or Xpedition software
• Familiarity with NX or other 3D modeling software

• Bachelor’s degree with 8 years of experience, a master’s degree with 6 years of experience or a PhD with 4 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement.
• U.S Citizenship is required.
• The ability to obtain/maintain a DoD Active Secret clearance.
• A current/active clearance is not required to be considered for the position, but a final clearance is required to start
• Experience with PWB/CCA design and signal routing, including chip-scale packaging technologies and substrate WB layout
• Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
• Proficient with AutoCAD and/or Xpedition software
• Familiarity with NX or other 3D modeling software

• Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
• A current/active DoD Secret Clearance or higher
• Proficiency with ASME Y14.5 geometric dimensioning and…