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Plasma Enhanced CVD Semiconductor Process Engineer​/Principal Plasma Enhanced CVD Semiconducto

Job in Linthicum, Anne Arundel County, Maryland, USA
Listing for: Northrop Grumman
Full Time position
Listed on 2025-12-07
Job specializations:
  • Engineering
    Process Engineer, Electrical Engineering
Job Description & How to Apply Below
Position: Plasma Enhanced CVD Semiconductor Process Engineer / Principal Plasma Enhanced CVD Semiconducto[...]

Plasma Enhanced CVD Semiconductor Process Engineer / Principal Plasma Enhanced CVD Semiconductor Process Engineer 2nd shift - R

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history – from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon.

We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work – and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an independent and resourceful Plasma Enhanced Chemical Vapor Deposition (PECVD) Semiconductor Process Engineer. The Advanced Technology Lab (ATL) – located outside of Baltimore, Maryland – is where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman’s ATL semiconductor foundry supports a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide, Carbon Nanotubes) and provides leading edge technology development in superconducting electronics.

Our devices enable Northrop Grumman’s ground‑based radars, avionic radars, and space systems.

Join us for the chance to work with an experienced and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in production, R&D, ongoing long‑term programs, and new programs targeting future military platforms. The multidisciplinary foundry team enables activities from development to sustainment process engineering. ATL is responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, testing, and assembly.

Shift

and Availability

This is a full‑time 2nd shift position, covering at a minimum Monday – Friday 2 pm – 11 pm.

Responsibilities

The Plasma Enhanced Chemical Vapor Deposition (PECVD) Semiconductor Process Engineer will be responsible for:

  • All aspects of sustaining existing PECVD processes for a development line including process qualifications and technician training.
  • Interfacing with other unit process engineers, operations, and integration engineers during the design and execution of process/equipment improvement projects.
  • Developing PECVD processes for new materials and emerging technologies in both microelectronics and superconducting electronics.
  • Writing and maintaining process documentation.
  • Supporting statistical process control (SPC) and continuous improvement efforts.
  • Performing all other related duties as assigned.
Basic Qualifications for Plasma Enhanced Chemical Vapor Deposition (PECVD) Semiconductor Process Engineer
  • Bachelor of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or any related STEM degree with 2 years relevant industry experience (Masters with 0 years exp).
  • Hands‑on experience running PECVD/Diffusion process equipment and with process sustaining/development activities.
  • Experience with TEOS‑ and silane‑based dielectric deposition.
  • Experience with thin‑film characterization equipment and techniques.
  • Must be able to work a large percentage of time in a Class 100 cleanroom environment.
  • Must be able to work the 2nd shift, covering at a minimum Monday – Friday 2 pm – 11 pm.
  • Knowledge of statistical process control (SPC).
  • Must be able to obtain and maintain a Secret clearance.
  • US Citizenship required.
Basic Qualifications for Principal Plasma Enhanced Chemical Vapor Deposition (PECVD) Semiconductor Process Engineer
  • Bachelor of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or any related…
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