Associate Characterization Fab Engineer​/Characterization Fab Engineer; 3rd shift - R10215034

Job Overview

At Northrop Grumman, employees work on revolutionary systems that impact people’s lives worldwide. The Northrop Grumman Microelectronics Center (NGMC) – located in Linthicum, MD – is hiring an Associate Characterization Fab Engineer / Characterization Fab Engineer (3rd shift) to join our Advanced Technology Lab (ATL). The role requires full on‑site presence.

Relocation Assistance: May be available
Clearance Type: Secret
Travel: Yes, 10% of the time

• Serve as the first line of defense for Characterization Engineering fab issues, spending 60–70% of the shift in the cleanroom.
• Maintain existing and create new in‑line metrology and defect metrology recipes and techniques.
• Operate microscopes for visible inspection.
• Assist with integrating in‑line defect metrology into process flows.
• Support operations in addressing lot holds across the Characterization Engineering tool fleet.
• Partner with vendors and equipment engineers to keep tools in good health and ready‑to‑use state.
• Support statistical process control (SPC), continuous improvement efforts, and manage dissemination of metrology and defect metrology data.

• Bachelor’s degree in Electrical, Chemical, Materials, Mechanical Engineering, Chemistry, Physics, or related field; 0 years of relevant experience.
• General understanding of defect inspection and review tools (dark field, bright field, SEM).
• Basic knowledge of metrology tools (CD SEMs, litho overlay, surface topology profilers, thin‑film thickness tools) or analytical tools.
• Ability to work 3rd shift hours (11 PM–8 AM Mon‑Fri; options for 5x8 or 9/80B schedule).
• Basic knowledge of statistical process control.
• Hands‑on experience with Si, GaAs, or other wafers.
• Ability to work in a cleanroom setting.
• U.S. Citizenship required.
• Ability to obtain and maintain a DoD Secret clearance.

• Bachelor’s degree in Electrical, Chemical, Materials, Mechanical Engineering, Chemistry, Physics, or related field; 2 years of relevant experience.
• General understanding of defect inspection and review tools (dark field, bright field, SEM).
• Basic knowledge of metrology tools (CD SEMs, litho overlay, surface topology profilers, thin‑film thickness tools) or analytical tools.
• Ability to work 3rd shift hours (11 PM–8 AM Mon‑Fri; options for 5x8 or 9/80B schedule).
• Basic knowledge of statistical process control.
• Hands‑on experience with Si, GaAs, or other wafers.
• Ability to work in a cleanroom setting.
• U.S. Citizenship required.
• Ability to obtain and maintain a DoD Secret clearance.

• Hands‑on knowledge and operation of defect inspection and review tools (dark field, bright field, SEM).
• Hands‑on knowledge and operation of metrology tools (CD SEMs, litho overlay, surface topology profilers, thin‑film thickness tools) or analytical tools.
• Experience in lean manufacturing practices and structured problem‑solving methodology.
• Experience working in a cleanroom setting.
• 1 year experience with semiconductor fabrication.
• Data analysis and visualization (JMP).
• Experience developing technical specifications for equipment procurement.
• Active Secret clearance.

Primary Level Salary Range: $70,600.00 – $
Secondary Level Salary Range: $85,400.00 – $

Employees may be eligible for overtime, shift differential, and discretionary bonuses. Benefits include health insurance, life and disability insurance, savings plan, company‑paid holidays, and paid time off (PTO).

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit  U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.