Microelectronics​/Principal Microelectronics Wet Etch Sustaining Eng - 4th Shift - R10213075

Microelectronics/Principal Microelectronics Wet Etch Sustaining Eng - 4th Shift - R

Northrop Grumman invites you to apply for the Microelectronics/Principal Microelectronics Wet Etch Sustaining Engineer role on the 4th shift. This position is located outside Baltimore, Maryland, within the Advanced Technology Lab (ATL) of the Northrop Grumman Microelectronics Center (NGMC).

Relocation assistance: May be available.
Clearance type: Secret.
Travel: Yes, 10% of the time.

At Northrop Grumman, our employees contribute to revolutionary systems that impact lives worldwide. The Microelectronics Wet Etch Sustaining Engineer supports semiconductor fabrication, working closely with multiple programs and area managers to ensure on‑time delivery of products across a range of silicon semiconductor technologies.

• Monitor and maintain wet etch processing tools and specifications.
• Lead continuous improvement initiatives.
• Install and calibrate new equipment.
• Provide technician training and conduct RCCA investigations.
• Support research, design, and development of new microelectronic and optoelectronic processes.
• Utilize wet processing equipment to develop new fabrication techniques for semiconductor technologies.
• Assist Process Integrators and Senior Process Engineers on wet process development.

• Bachelor’s degree in Chemical, Electrical, or Materials Engineering (or related) with 2 years of related semiconductor fabrication experience, or a Master’s degree with no experience.
• Direct experience in a lab or cleanroom environment.
• Understanding of semiconductor processing.
• Experience troubleshooting wet chemical processes and equipment.
• Experienced with characterization techniques for wet process engineering.
• Knowledge of Statistical Process Control (SPC) and related tools.
• Structured problem‑solving methodology for equipment and process issues.
• General MS Office suite experience.
• Ability to work in a Class 100 cleanroom environment with chemicals.
• Physical and PPE requirements met.
• Availability for 4th shift (Fri, Sat, Sun 7 am–7 pm).
• U.S. citizenship.
• Ability to obtain a Secret clearance.

• Bachelor’s degree with 5 years of semiconductor fabrication experience (or a Master’s degree with 3 years, or a PhD with 1 year).
• Direct experience in a lab or cleanroom environment.
• Understanding of semiconductor processing.
• Experience troubleshooting wet chemical processes and equipment.
• Experienced with characterization techniques for wet process engineering.
• Knowledge of SPC and related tools.
• Structured problem‑solving methodology for equipment and process issues.
• General MS Office suite experience.
• Ability to work in a Class 100 cleanroom environment with chemicals.
• Physical and PPE requirements met.
• Availability for 4th shift (Fri, Sat, Sun 7 am–7 pm).
• U.S. citizenship.
• Ability to obtain a Secret clearance.

• Familiarity with wet etch and electroplating tools, processes, and troubleshooting.
• Existing Secret clearance.

Primary Level: $85,400 – $128,000
Secondary Level: $105,400 – $158,000

Additional compensation may include overtime, shift differential, discretionary bonuses, and long‑term incentives for eligible positions. Benefits include health insurance, life and disability insurance, savings plan, paid holidays and PTO.

Approximately 20 days from the posting date, subject to business needs and candidate availability.

Northrop Grumman is an Equal Opportunity Employer and makes hiring decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit  U.S. Citizenship is required for all positions with a government clearance and certain restricted positions.