CAE Engineer

Your Job

We are seeking an enthusiastic and motivated CAE Engineer to join our team, performing structural simulations and optimization for datacom interconnect products. This role requires design, analysis, and optimization of innovative high‑speed interconnect products for datacom applications.

In this role you will have the opportunity to perform advanced FEA simulations and optimizations on Molex products.

At Molex, we create connections for life by enabling technologies that transform the future and improve lives. With a presence in more than 40 countries, we offer a complete range of connectivity products, services, and solutions across various industries, including data communications, medical, industrial, automotive, and consumer electronics.

Our Datacom and Specialty Solutions (DSS) team specializes in providing high speed connector solutions essential for building reliable communications equipment, catering to telecommunications, datacom, hyperscalers, cloud, data center, and storage applications. We continue to innovate to meet the demands of next‑generation markets.

• Conduct and coordinate nonlinear structural finite element analysis (FEA) for short fiber reinforced plastic & copper alloy‑based high‑speed interconnect systems, through Hypermesh & LS‑DYNA tools or Abaqus tools.
• Deliver reliable FEA results in a timely manner and effectively communicate them with product design engineers through clear written and verbal presentations.
• Provide design recommendations to improve and optimize product structural performance based on FEA results, ensuring that design targets are met.
• Participate in the correlation of CAE simulations to real‐world tests and improve existing modeling methods as needed.
• Develop new FEA techniques and modeling methods, working both independently and collaboratively with vendors to improve their accuracy and efficiency.
• Lead the development of new products and oversee the activities of global teams, ensuring alignment with engineering management priorities.
• Publish technical papers and patents.

• B.S. Degree in Mechanical or Related Engineering Discipline.
• 1+ years' experience with parametric CAD systems (UG NX, CATIA, Solid Works, etc.)
• 1+ years' experience with LS‑DYNA, ABAQUS, or ANSYS Workbench simulation software.
• 1+ years' experience with Altair (Hypermesh/Hyperview) family products.
• Proficiency in Python scripting for data processing, automation, or simulation integration.

• M.S. or Ph.D. degree in Mechanical Engineering or a related engineering discipline.
• 3+ years' experience with CAE modeling applications in predicting nonlinear structural behavior on short fiber reinforced plastics & metals.
• Experience with molding simulation software, e.g., Moldflow, Moldex‑3D, Digimat, Converse, etc.
• Hands‑on experience with optimization software such as Mode Frontier, OptiSLang, or Isight.
• Familiarity with machine learning and deep learning techniques, including physics‑informed neural networks (PINNs).
• Established records of publication such as patents and technical papers.

For this role, we anticipate paying $90,000 - $120,000 per year. This role is eligible for variable pay, issued as a monetary bonus or in another form.

At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location.

If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy.

All Koch companies value diversity of thought, perspectives, aptitudes, experiences, and backgrounds. We are Military Ready and Second Chance employers. Learn more about our hiring philosophy here.

As a Koch company, Molex is a leading supplier of connectors and interconnect components, driving innovation in electronics and…