Electromechanical Packaging Engineer III - Electro-Optical Components

At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight! This role is part of Blue National Security (BNS), where our focus is the design, development, and delivery of launch and spacecraft systems for national security missions.

Through Blue Ring, our all‑in‑one, high‑powered hybrid solar‑electric and chemical‑propelled spacecraft, we provide unmatched mission maneuverability, versatility, and capacity at dramatically lower‑profile costs. Build the Hardware That Survives Space Space is unforgiving: extreme temperatures, violent vibration and shock, radiation, and vacuum. The electronics and photonics flying on Blue Origin spacecraft have to survive all of it.

We need an experienced packaging engineer to own ruggedized enclosures, electro‑optical assemblies, and fiber‑optic integration from concept through flight release. This role supports classified programs. Candidates must be eligible to obtain and maintain a U.S. government security clearance. An existing clearance is preferred but not required; we’re glad to sponsor the right candidate.

The Mission Blue Origin is building the infrastructure for humanity's future in space. Optical communications is becoming a core capability for high‑rate space networking, and the hardware that makes it work has to hold tight thermal stability and precise optical interfaces while surviving launch and years on orbit. That's fundamentally a mechanical and thermal problem, and it's the one this team solves.

You'll own the mechanical design of the electro‑optical units at the center of that system: modem processing and photonics units, electro‑optic assemblies, transceiver hardware, and optical amplifier assemblies, plus the chassis and stacked‑unit architectures that house them. The thermal paths that keep lasers, modulators, and receivers stable enough to close a link are yours, along with the fiber‑optic tray and every fiber run, splice, and junction inside the box, and the interfaces that let your units mount to the optical payload and host spacecraft.

You'll work closely with electrical engineers and PCB designers throughout, because on hardware this dense, mechanical, thermal, and electrical design converge or fail together.

• Own complex packaging assemblies including enclosures, chassis, card-cage and stacked‑unit architectures, mounting systems, and fiber junction housings, across the full lifecycle from requirements through production support.
• Lead the mechanical and thermal design of modem processing and photonics units, integrating high‑speed digital boards, photonics boards, electro‑optic daughter cards, and power conversion slices into flight‑qualifiable, mass‑ and volume‑efficient packages. Package optical amplifier and transceiver‑class hardware, addressing high optical power handling, fiber end‑face reliability, hermeticity, and moisture control.
• Own the mechanical thermal design with thermal engineering: heat rejection paths, mounting materials, heater placement, thermal isolation, and thermal control of tunable lasers, modulators, and TEC‑cooled devices, where drift drives calibration burden and link margin.
• Own fiber optic tray design and all internal fiber management: layout, routing, bend‑radius control, strain relief, splice retention, and connector selection. Define the splicing and workmanship processes and specify the equipment to execute them.
• Define mechanical and installation requirements for electrical harnesses and carry them through detailed…