Sr Principal Process Development Engineer

Form Factor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle — from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon Form Factor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The company serves customers through its network of facilities in Asia, Europe, and North America.

Rooted in our core values — Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People — we foster an environment where diverse perspectives are not only welcomed but celebrated. Everyone can make an impact here. Whether it's improving products, supporting customers, or positively influencing peers and the community, the contributions of our people matter.

The regular hours for this position are day shift.

The Sr Principal Process Development Engineer is responsible for owning, optimizing, and supporting Surface Mount Technology processes used in probe card manufacturing. This role ensures high‑quality PCB assembly, stable process capability, and predictable output across pick‑and‑place, reflow, inspection, and associated upstream/downstream steps. The engineer provides technical leadership for SMT line performance, defect reduction, equipment improvements, and cross‑functional integration with plating, lithography, mechanical assembly, and electrical test teams.

• SMT Process Engineering Develop, qualify, and maintain SMT processes, solder paste selection, solder paste injection and inspection, reflow profiling, and placement parameters. Own recipe creation and optimization for high‑density advanced probe card PCBs. Drive process capability improvements (Cp/Cpk) and ensure stable production performance.
• Equipment Ownership Provide daily engineering support for SMT equipment such as:
  Stencil printer Pick‑and‑place machine Reflow oven SPI (Solder Paste Inspection) Lead troubleshooting and root cause analysis for equipment failures, misplacements, reflow defects, or inspection inaccuracies. Define and maintain PM schedules, calibration, and spare parts strategies.
• Quality & Yield Improvement Monitor and analyze yield, defect Paretos, and SPC trends to identify systemic issues. Lead DfX (Design for Assembly, Design for Manufacturability) discussions with design engineering. Implement corrective actions and sustainable process controls for solder bridging, opens, voiding, tomb stoning, and wetting failures.
• Manufacturing Support Support production technicians with process deviations, equipment issues, and new product introductions. Develop documentation including WI/SOPs, process parameters, machine setup sheets, and inspection criteria. Drive cycle time reduction, throughput improvements, and operator training.
• Cross‑Functional Collaboration Work closely with:
  Plating & Metallization Engineers Photolithography Engineers Mechanical/Assembly Engineering Electrical Test Engineering (FPT, PRVX4) Supply Chain & Quality Provide engineering support during prototype builds and customer‑specific configurations.
• Continuous Improvement Lead Lean/6σ initiatives to reduce waste, improve flow, and enhance process robustness. Evaluate and introduce new materials (solder paste, adhesives, fluxes) and improved stencil/hardware designs. Participate in equipment justification and capital project planning.

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Science, or…