Senior Packaging Engineer

Location: Greater London

Senior / Staff Packaging Engineer

London (Hybrid)

My client is an innovative AI hardware startup developing next-generation computing technology designed to revolutionise AI infrastructure. They're looking for an experienced Packaging Engineer to help bridge the gap between cutting-edge silicon and high-performance products, working on advanced semiconductor technologies alongside a world-class engineering team.

Role Requirements:

* Lead the development of advanced semiconductor packaging solutions from concept through to production

* Design and optimise package, substrate and system-level integration for high-performance devices

* Work across package architecture, layout, simulation and product development activities

* Collaborate with ASIC, hardware and systems engineers to deliver innovative packaging solutions

Key

Skills Required:

* Experience in semiconductor packaging or advanced electronic packaging

* Knowledge of package, substrate or PCB design and integration

* Experience using industry-standard package or PCB design tools

* Understanding of signal integrity, power integrity or high-speed design principles

* Experience working with multidisciplinary engineering teams throughout product development

If this sounds like you, please apply